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電磁波シールドパッケ...

電磁波シールドパッケージにおけるモールド樹脂とスパッタ成膜間の界面挙動

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電磁波シールドパッケージにおけるモールド樹脂とスパッタ成膜間の界面挙動

Call No. (NDL)
Z74-H317
Bibliographic ID of National Diet Library
033066513
Material type
記事
Author
本間 荘一ほか
Publisher
大阪 : 高温学会
Publication date
2023-09
Material Format
Paper
Journal name
スマートプロセス学会誌 = Journal of smart processing 12(5):2023.9
Publication Page
p.291-298
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Paper Digital

Material Type
記事
Author/Editor
本間 荘一
岡田 大地
澤登 昭仁
山本 進
井本 孝志
西川 宏
Alternative Title
Interfacial Behavior Between Mold Resin and Sputtered Film Deposited on Electromagnetic Shield Packages
Periodical title
スマートプロセス学会誌 = Journal of smart processing
No. or year of volume/issue
12(5):2023.9
Volume
12
Issue
5
Pages
291-298