電磁波シールドパッケージにおけるモールド樹脂とスパッタ成膜間の界面挙動
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- Material Type
- 記事
- Author/Editor
- 本間 荘一岡田 大地澤登 昭仁山本 進井本 孝志西川 宏
- Alternative Title
- Interfacial Behavior Between Mold Resin and Sputtered Film Deposited on Electromagnetic Shield Packages
- Periodical title
- スマートプロセス学会誌 = Journal of smart processing
- No. or year of volume/issue
- 12(5):2023.9
- Volume
- 12
- Issue
- 5
- Pages
- 291-298