文書・図像類

ウエットブラスト加工に関する基礎的研究(投射固体粒子径の単結晶Siウェハの加工メカニズムへの影響)

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ウエットブラスト加工に関する基礎的研究(投射固体粒子径の単結晶Siウェハの加工メカニズムへの影響)

Material type
文書・図像類
Author
董, 博宇ほか
Publisher
日本機械学会
Publication date
2010-03
Material Format
Digital
Capacity, size, etc.
-
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  • University of Fukui Academic Repository

    Digital
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Digital

Material Type
文書・図像類
Author/Editor
董, 博宇
宮島, 敏郎
松原, 亨
岩井, 善郎
DONG, Boyu
MIYAJIMA, Toshiro
MATSUBARA, Tohru
IWAI, Yoshiro
Publication, Distribution, etc.
Publication Date
2010-03
Publication Date (W3CDTF)
2010-03
Alternative Title
A Fundamental Study of Wet Blast Processing (Solid Particle Size Effects on Processing Mechanism of Monocrystalline Silicon Wafer)
Periodical title
日本機械学会論文集(C編)
No. or year of volume/issue
76 763