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Analysis of dissolution of partially aggregated resist particles due to stochastic effect of exposure using DLA model

Analysis of dissolution of partially aggregated resist particles due to stochastic effect of exposure using DLA model

Material type
その他
Author
佐々木, 明ほか
Publisher
-
Publication date
2019-09-16
Material Format
Paper
Capacity, size, etc.
-
NDC
-
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Notes on use

Note (General):

SPIE photomask technology + EUV lithography

Detailed bibliographic record

Summary, etc.:

Exposure and development processes of EUV resists are investigated using numerical model and simulation. Diffusion limited aggregation (DLA) and perco...

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Paper

Material Type
その他
Author/Editor
佐々木, 明
Sasaki, Akira
Publication Date
2019-09-16
Publication Date (W3CDTF)
2019
Target Audience
一般
Note (General)
SPIE photomask technology + EUV lithography
Data Provider (Database)
国立情報学研究所 : 学術機関リポジトリデータベース(IRDB)(機関リポジトリ)
Original Data Provider (Database)
国立研究開発法人量子科学技術研究開発機構 : 量子科学技術研究開発機構 学術機関リポジトリ