Journal of photopolymer science and technology

• Material Type: 雑誌
• ISSN: 0914-9244
• ISSN-L: 0914-9244
• Title: Journal of photopolymer science and technology
• Volume: 18(1)-18(6):2005
• Author Heading: フォトポリマー学会 フォトポリマー ガッカイ ( 001142273 )Authorities; Conference of Photopolymer Science and Technology ( 01236612 )Authorities; フォトポリマー懇話会 フォトポリマー コンワカイ ( 00283295 )Authorities
• Publication, Distribution, etc.: Chiba : The Society of Photopolymer Science and Technology
• Publication Date: 2005
• Publication Date (W3CDTF): 2005
• Note (Publication, distribution, etc.): Place of publication varies; Publisher: Technical Association of Photopolymers, Japan (v. 6, no. 1-v. 23, no. 6); The Conference of Photopolymer Science and Technology (v. 24, no. 1-v. 25, no. 6)
• Year and volume of publication: v. 6, no. 1 (1993)-
• Size: 29cm
• Place of Publication (Country Code): JP
• Text Language Code: eng
• NDLC: ZP48
• Note (General): Description based on the latest issue; Frequency varies
• Holding library: 国立国会図書館
• Call No.: Z53-W515
• Related Material: 区分換; https://ndlsearch.ndl.go.jp/books/R100000002-I000000065969
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 000000156586; http://id.ndl.go.jp/bib/000000156586
• National Bibliography No. (JPNO): 10050993
• Cataloging Rule: National Diet Library Cataloging Rules for Serials
• Bibliographic Record Category (NDL): 132

Table of Contents

The Photopolymer Science and Technology Award

Photosensitive Column Spacer Materials for Liquid Crystal Display Panels

Photoalignment Control of Liquid Crystals on Photo-Cross-Linkable Polymer Liquid Crystal Film

Control of Liquid Crystal Alignment on Crosslinkable Polymer Surfaces with Photo and Plasma Modification

Influence of Polymer Wall Formation on Alignment Behaviors of Ferroelectric Liquid Crystal Devices

Characterization of t-Butoxycarbonyloxy-containing Polymer(2)Development and Evaluation of the Binary Hologram Master

Removal of Positive-tone Diazonaphthoquinone/Novolak Resist Using UV Laser lrradiation

Control Photo and Thermal Decomposition of Diazo/PVA and Diazo/PVAc Resist with Inclusion Compounds

Morphological Control of Deposits from a Gaseous Mixture of Allyltrimethylsilane and Iron Pentacarbonyl

Multi-Functional Methacrylates Bearing Thermal Degradation Properties--Synthesis, Photo- and Thermal Curing, and Thermolysis

Possible Origins and Some Methods to Minimize LER

Line Edge Roughness in Chemically Amplified Resist: Speculation, Simulation and Application

The Impact of Fluoropolymers on Line Edge Roughness in 193 nm Imaging

Basic Aspects of Acid Generation Process in Chemically Amplified Electron Beam Resist

Outgassing Analysis in EUV Resist

Innovative Process and Material for sub-80nm Lithography (M+ Process)

Condensation Behavior of Nanoscale Bubbles on ArF Excimer Resist Surface Analyzed by Atomic Force Microscope

Characterization and Lithographic Performance of Silsesquioxane 193 nm Bilayer Resists

High Etch-Resistant Silicon Containing Bilayer Resist: Lithographic Performance & Outgassing Studies

Interaction Analysis of DI-water/Air/ArF Resist System using Atomic Force Microscope

Novolak Resist Removal Using Laser(266/532nm)

Visible-Light-Sensitive Photo-Acid Generator Incorporating Food Dye for Use in Chemically Amplified Resists

Polymer Complex Formation between Poly(vinylpyridines) and Poly(acrylic acid) and the Effects of UV-irradiation

Rheological Properties of UV-curable Flexographic Ink(2)Influence of Interfacial Interactions in Relation to Rheological Variables of Ink and its Printability

Transient Absorption Spectra of Electron Beam Sensitive Polyimides and their Model Compounds

Some Issues in the Mechanical Forming of Nanoimprint Structures

Fabrication of Multi-bit Crossbar Circuits at Sub-50 nm Half-pitch by Using UV-based Nanoimprint Lithography

Opportunities and Challenges in Immersion Lithography

Optical Lithography for the 32nm node

Numerical Investigations on Requirements for BARK Materials for Hyper NA Immersion Lithography