Materials transactions

• Material Type: 雑誌
• ISSN-L (error code): 0021-4434
• Title: Materials transactions
• Volume: 51(9)-51(12):2010.9-2010.12(P.1497-2332)
• Author Heading: 日本金属学会 ニホン キンゾク ガッカイ ( 00256733 )Authorities
• Publication, Distribution, etc.: Sendai : The Japan Institute of Metals and Materials; Tokyo : Distributed by Maruzen-Yushodo
• Publication Date: 2010
• Publication Date (W3CDTF): 2010
• Note (Publication, distribution, etc.): Publisher: The Japan Institute of Metals (v. 42, no. 1-v. 54, no. 2); Distributer: Maruzen (v. 28, no. 1-v. 57, no. 1)
• Year and volume of publication: v. 42, no. 1 (Jan. 2001)-
• Size: 30cm
• ISSN (Periodical Title): 1345-9678
• ISSN-L (Periodical Title): 1345-9678
• Place of Publication (Country Code): JP
• Text Language Code: eng
• NDLC: ZP41
• Note (General): Description based on the latest issue
• Holding library: 国立国会図書館
• Call No.: Z53-J286
• Replaces: 継続前 : Materials transactions, JIM (ISSN:0916-1821); https://ndlsearch.ndl.go.jp/books/R100000002-I000000147514
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 000000163280; http://id.ndl.go.jp/bib/000000163280
• Cataloging Rule: Nippon Cataloguing Rules 1987 Revised Edition

Table of Contents

First-principles study of 30H-BN polytypes

Enhancement of plasticity of highly density-fluctuated Cu-Zr amorphous alloy

Supercooling of homogeneous liquid phase of liquid metals and alloys: poor supercooling around the eutectic composition of liquid Ni-Nb system

A smoothing filter for misorientation mapping obtained by EBSD

Theoretical calculation of activation free energy for self-diffusion in prototype crystal

Special issue on lead-free and advanced interconnection materials for electronics

A reliability study of nanoparticles reinforced composite lead-free solder (Special issue on lead-free and advanced interconnection materials for electronics)

Effects of Zn-bearing flux on joint reliability and microstructure of Sn-3.5Ag soldering on electroless Ni-Au surface finish (Special issue on lead-free and advanced interconnection materials for electronics)

Effect of in addition on wetting properties of Sn-Zn-In/Cu soldering (Special issue on lead-free and advanced interconnection materials for electronics)

Effects of post-plating reflow on changes in crystal grain size of Sn-2 mass%Bi alloy plating with thermal cycling treatment (Special issue on lead-free and advanced interconnection materials for electronics)

Structure, dye degradation activity and stability of oxygen defective BaFeO3-x

Core-shell formation and juxtaposition in Fe and Si hybrid clusters prepared by controlling the collision stages

Dynamic electropulsing induced phase transformations in a furnace cooled Zn-Al based alloy (ZA22)

Ab initio molecular dynamics study of Fe adsorption on TiN (001) surface

Grain refinement and hardness increase of titanium via trace element addition

Composition control of Pd-Cu-Si metallic glassy alloys for thin film hydrogen sensor

The effects of element substitution on electronic structure, electron transport properties, and lattice thermal conductivity of Fe2VAl thermoelectric material

Preparation and thermal analysis of Sn-Ag nano solders

All-electron GW calculations of silicon, diamond, and silicon carbide

Organic suspension behavior of rutile TiO2 nanoparticles with high specific surface area