Effect of third element on the mechanical reliability of Sn-3.5 mass%Ag lead-free solder for microjoining and anti-fatigue damage design in the development of new lead-free Solder

• Material Type: 博士論文
• Title: Effect of third element on the mechanical reliability of Sn-3.5 mass%Ag lead-free solder for microjoining and anti-fatigue damage design in the development of new lead-free Solder
• Author/Editor: 苅谷義治 [著]
• Author Heading: 苅谷, 義治 カリヤ, ヨシハル
• Degree grantor/type: 芝浦工業大学
• Date Granted: 平成11年3月18日
• Date Granted (W3CDTF): 1999
• Dissertation Number: 甲第12号
• Degree Type: 博士(工学)
• Note (Dissertation): 博士論文
• Place of Publication (Country Code): JP
• NDLC: UT51
• Note (General): 博士論文
• Holding library: 国立国会図書館
• Call No.: UT51-99-K114
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 000000336338; http://id.ndl.go.jp/bib/000000336338
• Bibliographic Record Category (NDL): 213

Table of Contents

Contents

1 General Introduction

1.1 Tin-lead solders

1.2 Soldering in electronics industry and reliability issue

1.3 Environmental concerns of lead