半導体パッケージングの最新技術 (Technical report ; no.60)
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国立国会図書館デジタルコレクション
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Table of Contents
目次
第1章 概論
1． 半導体部品のパッケージング/ 1
2． 半導体パッケージングの今後の動向/ 4
2．1 デュアルレインラインパッケージ（DIP）/ 4
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Kanto
神奈川県立川崎図書館
Paper- Call No.：
- 549.7-H13
- Book Registration Number：
- 71224976
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Bibliographic Record
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- Material Type
- 図書
- Title
- Title Transcription
- ハンドウタイ パッケージング ノ サイシン ギジュツ
- Author/Editor
- 英一太 著
- Series Title
- Author Heading
- 英, 一太, 1925- ハナブサ, イッタ, 1925- ( 00099521 )Authorities
- Publication, Distribution, etc.
- Publication Date
- 1984.8
- Publication Date (W3CDTF)
- 1984
- Extent
- 198p