図書

表面実装形LSIパッケージの実装技術とその信頼性向上

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表面実装形LSIパッケージの実装技術とその信頼性向上

Call No. (NDL)
ND386-E58
Bibliographic ID of National Diet Library
000001971707
Persistent ID (NDL)
info:ndljp/pid/13649531
Material type
図書
Author
日立製作所半導体事業部 編
Publisher
応用技術出版
Publication date
1988.11
Material Format
Paper・Digital
Capacity, size, etc.
514p ; 27cm
NDC
549.7
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Notes on use

Note (General):

監著: 村上元発売: 技術情報センター

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Paper Digital

Material Type
図書
Title Transcription
ヒョウメン ジッソウケイ エルエスアイ パッケージ ノ ジッソウ ギジュツ ト ソノ シンライセイ コウジョウ
Author/Editor
日立製作所半導体事業部 編
Author Heading
日立製作所 ヒタチ セイサクジョ ( 00282559 )Authorities
Publication, Distribution, etc.
Publication Date
1988.11
Publication Date (W3CDTF)
1988
Extent
514p
Size
27cm