博士論文

Electromigration Behavior and Reliability of Aluminum-Based Multilevel Interconnects for Integrated Circuits

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Electromigration Behavior and Reliability of Aluminum-Based Multilevel Interconnects for Integrated Circuits

Call No. (NDL)
LS-DI-MIT-92-179
Bibliographic ID of National Diet Library
000003378694
Material type
博士論文
Author
Kahn, Harold.
Publisher
Massachusetts Institute of Technology
Publication date
1992.
Material Format
Microform
Capacity, size, etc.
190 p.
Name of awarding university/degree
Massachusetts Institute of Technology
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Microform

Material Type
博士論文
Author/Editor
Kahn, Harold.
Author Heading
Publication Date
1992.
Extent
190 p.
Degree grantor/type
Massachusetts Institute of Technology
Date Granted
1992.
Date Granted (W3CDTF)
1992