Microstructurally based model of solder joints under conditions of thermomechanical fatigue SAND-94-0951C DE95 006226 CONF-9503445

Microstructurally based model of solder joints under conditions of thermomechanical fatigue

SAND-94-0951C DE95 006226 CONF-9503445

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Material Type: 規格・テクニカルリポート類
Title: Microstructurally based model of solder joints under conditions of thermomechanical fatigue
Author/Editor: Frear, D. R
Burchett, S. N
Rashid, M. M
Publication Date: 1994
Publication Date (W3CDTF): 1994
Extent: 14 p. (1 microfiche)
Note (Material Type): [microform]
Report No.: テクニカルリポート番号 : SAND-94-0951C
テクニカルリポート番号 : DE95 006226
テクニカルリポート番号 : CONF-9503445
Holding library: 国立国会図書館
Call No.: LS-DE95/006226
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000005517136
http://id.ndl.go.jp/bib/000005517136
Bibliographic Record Category (NDL): 291