Laser micromachining of through via interconnects in active die for 3-D multichip module SAND-95-0797C DE95 017548 CONF-95102091

Laser micromachining of through via interconnects in active die for 3-D multichip module

SAND-95-0797C DE95 017548 CONF-95102091

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Material Type: 規格・テクニカルリポート類
Title: Laser micromachining of through via interconnects in active die for 3-D multichip module
Author/Editor: Chu, D
Miller, W. D
Publication Date: 1995
Publication Date (W3CDTF): 1995
Extent: 6 p. (1 microfiche)
Note (Material Type): [microform]
Report No.: テクニカルリポート番号 : SAND-95-0797C
テクニカルリポート番号 : DE95 017548
テクニカルリポート番号 : CONF-95102091
Holding library: 国立国会図書館
Call No.: LS-DE95/017548
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000005536652
http://id.ndl.go.jp/bib/000005536652
Bibliographic Record Category (NDL): 291