Evolving microstructure: Mechanisms of electromigration in stressed aluminum-copper and copper films UCRL-ID-124556 DE96 012962

Evolving microstructure: Mechanisms of electromigration in stressed aluminum-copper and copper films

UCRL-ID-124556 DE96 012962

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Material Type: 規格・テクニカルリポート類
Title: Evolving microstructure: Mechanisms of electromigration in stressed aluminum-copper and copper films
Author/Editor: Fluss, M
Genin, F
Kim, C
Morris, J. W., Jr
Publication Date: 1996
Publication Date (W3CDTF): 1996
Extent: 4 p. (1 microfiche)
Note (Material Type): [microform]
Report No.: テクニカルリポート番号 : UCRL-ID-124556
テクニカルリポート番号 : DE96 012962
Holding library: 国立国会図書館
Call No.: LS-DE96/012962
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000005857249
http://id.ndl.go.jp/bib/000005857249
Bibliographic Record Category (NDL): 291