Mechanical reliability and failure analysis of PBGA packages soldered on electroless Ni/immersion Au and organic coated Cu ASME-97-WA/EEP-10

Mechanical reliability and failure analysis of PBGA packages soldered on electroless Ni/immersion Au and organic coated Cu

ASME-97-WA/EEP-10

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Material Type: 規格・テクニカルリポート類
Title: Mechanical reliability and failure analysis of PBGA packages soldered on electroless Ni/immersion Au and organic coated Cu
Author/Editor: Mei, Zequn
Callery, Patrick
Publication Date: 1997
Publication Date (W3CDTF): 1997
Extent: 10 p
Alternative Title: ASME international mechanical engineering congress & exposition. Dallas, Tex. Nov. 1997
Report No.: テクニカルリポート番号 : ASME-97-WA/EEP-10
Holding library: 国立国会図書館
Call No.: M-ASME-97-WA/EEP-10
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000005868098
http://id.ndl.go.jp/bib/000005868098
Bibliographic Record Category (NDL): 291