Effects of printed circuit board thickness on solder joint reliability of flip chip assemblies with imperfect underfill ASME-99-IMECE/EEP-4

Effects of printed circuit board thickness on solder joint reliability of flip chip assemblies with imperfect underfill

ASME-99-IMECE/EEP-4

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Material Type: 規格・テクニカルリポート類
Title: Effects of printed circuit board thickness on solder joint reliability of flip chip assemblies with imperfect underfill
Author/Editor: Lau, John H
Lee, S.-W. Ricky
Publication Date: 1999
Publication Date (W3CDTF): 1999
Extent: 8 p
Alternative Title: ASME international mechanical engineering congress & exposition. Nashville, Tenn. Nov. 1999
Report No.: テクニカルリポート番号 : ASME-99-IMECE/EEP-4
Holding library: 国立国会図書館
Call No.: M-ASME-99-IMECE/EEP-4
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000006068985
http://id.ndl.go.jp/bib/000006068985
Bibliographic Record Category (NDL): 291