Chemical mechanical planarization 6 : proceedings of the international symposium. : 6th internatioal symposium on chemical mechanical plananrization[i.e. planarization] (CMP) in integrated circuit device manufacturing : 204th meeting of the Electrochemical Society : Oct 2003, Orlando, FL. (PV ; 2003-21)

Chemical mechanical planarization 6 : proceedings of the international symposium. : 6th internatioal symposium on chemical mechanical plananrization[i.e. planarization] (CMP) in integrated circuit device manufacturing : 204th meeting of the Electrochemical Society : Oct 2003, Orlando, FL.

(PV ; 2003-21)

Call No. (NDL): M17-04-2208
Bibliographic ID of National Diet Library: 000007334610

Material type: 図書

Author: Seal, S. (Sudipta)ほか

Publisher: Electrochemical Society

Publication date: c2003.

Material Format: Paper

Capacity, size, etc.: vii, 358 p. : ill. ; 24 cm.

NDC: -

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Note (General)：: Papers."This volume is the proceedings of the 6th International Symposium on Chemical Mechanical Plananrization (CMP) in Integrated Circuit Device Man...

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Paper

Material Type: 図書
ISBN: 1566774047
Title: Chemical mechanical planarization 6 : proceedings of the international symposium. : 6th internatioal symposium on chemical mechanical plananrization[i.e. planarization] (CMP) in integrated circuit device manufacturing : 204th meeting of the Electrochemical Society : Oct 2003, Orlando, FL.
Series Title: PV ; 2003-21
Title Heading: Proceedings (Electrochemical Society) ; v. 2003-21.
Author Heading: Seal, S. (Sudipta)
Electrochemical Society. Meeting (204th : 2003 : Orlando, Fla.)
International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (6th : 2003 : Orlando, Fla.)
Publication, Distribution, etc.: Pennington : Electrochemical Society
Publication Date: c2003.
Publication Date (W3CDTF): 2003
Extent: vii, 358 p. : ill. ; 24 cm.
Place of Publication (Country Code): US
Text Language Code: eng
Subject Heading: Microelectronics -- Materials -- Congresses.
Grinding and polishing -- Congresses.
Metals -- Pickling -- Congresses.
Integrated circuits -- Materials -- Congresses.
NDLC: M17
Note (General): Papers.
"This volume is the proceedings of the 6th International Symposium on Chemical Mechanical Plananrization (CMP) in Integrated Circuit Device Manufacturing held at the 204th Meeting of the Electrochemical Society, in Orlando, Florida from October 12th to 17th, 2003." -- pref.
Note (Bibliography): Includes bibliographical references and indexes.
Holding library: 国立国会図書館
Call No.: M17-04-2208
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000007334610
http://id.ndl.go.jp/bib/000007334610
RLIN No.: CSUGA5629440-B
Bibliographic Record Category (NDL): 215