半導体・電子デバイス包装技術

([エレクトロニクスシリーズ])

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Material Type: 図書
ISBN: 978-4-7813-0096-2
Title: 半導体・電子デバイス包装技術
Title Transcription: ハンドウタイデンシデバイスホウソウギジュツ
Author/Editor: 半導体新技術研究会編
村上元, 北村和平監修
Series Title: [エレクトロニクスシリーズ]
Author Heading: 半導体新技術研究会ハンドウタイシンギジュツケンキュウカイ ( 01120481 )Authorities
村上, 元ムラカミ, ゲン ( 01120487 )Authorities
北村, 和平キタムラ, ワヘイ ( 01167294 )Authorities
Publication, Distribution, etc.: 東京 : シーエムシー出版
Publication Date: 2009.5
Publication Date (W3CDTF): 2009
Extent: 261p
Size: 27cm
Place of Publication (Country Code): JP
Text Language Code: jpn
Subject Heading: 半導体--包装ハンドウタイホウソウ ( 01167297 )Authorities
NDC 9th ed.: 549.8 : Electronic engineering
NDLC: ND371
NDC (Introduction of Reference Books): 549.8
Target Audience: 一般
Price: 65000円
Holding library: 国立国会図書館
Call No.: ND371-J74
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000010247610
http://id.ndl.go.jp/bib/000010247610
National Bibliography No. (JPNO): 21615181
NS-MARC No.: 115025400
Cataloging Rule: Nippon Cataloguing Rules 1987 Revised Edition
Bibliographic Record Category (NDL): 112