2009 international conference on electronic packaging technology & high density packaging : (ICEPT-HDP 2009) : Beijing, China : 10-13 August 2009. : Aug 2009, Beijing, China.

• Material Type: 図書
• ISBN (set): 9781424446582 (set)
• Title: 2009 international conference on electronic packaging technology & high density packaging : (ICEPT-HDP 2009) : Beijing, China : 10-13 August 2009. : Aug 2009, Beijing, China.
• Author Heading: Tsinghua University.; Bi, Keyun.; Cai, Jian.; Beijing Faith Consulting Co., Ltd.; International Conference on Electronic Packaging Technology & High Density Packaging (2009 : Beijing, China)
• Publication, Distribution, etc.: Piscataway : IEEE
• Publication Date: c2009.
• Publication Date (W3CDTF): 2009
• Extent: 2 v. : ill. ; 28 cm.
• Alternative Title: 2009 international conference on electronic packaging technology and high density packaging : (ICEPT-HDP 2009) : Beijing, China : 10-13 August 2009
• Place of Publication (Country Code): US
• Text Language Code: eng
• Subject Heading: Electronic packaging -- Congresses.; Microelectronic packaging -- Congresses.
• LCC: TK7870.15
• NDLC: M17
• Note (General): Papers.; IEEE cat no CFP09553-PRT.
• Note (Bibliography): Includes bibliographical references and author index.
• Holding library: 国立国会図書館
• Call No.: M17-10-3071
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 000010901405; http://id.ndl.go.jp/bib/000010901405
• OCLC No.: 613499467; https://www.worldcat.org/oclc/613499467
• Bibliographic Record Category (NDL): 215

• Contents: [Vol. 1]: Pages 1-636[Vol. 2]: Pages 637-1273.(Provided by: 国立国会図書館蔵書)