博士論文

Three-dimensional chip integration technology for high density packaging

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Three-dimensional chip integration technology for high density packaging

Call No. (NDL)
UT51-2010-D751
Bibliographic ID of National Diet Library
000010949848
Material type
博士論文
Author
Katsuyuki Sakuma [著]
Publisher
[Katsuyuki Sakuma]
Publication date
[2010]
Material Format
Paper
Capacity, size, etc.
1冊
Name of awarding university/degree
早稲田大学,博士 (工学)
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博士論文

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Paper

Material Type
博士論文
Author/Editor
Katsuyuki Sakuma [著]
Author Heading
佐久間, 克幸 サクマ, カツユキ
Publication, Distribution, etc.
Publication Date
[2010]
Publication Date (W3CDTF)
2010
Extent
1冊
Alternative Title
高密度実装のための3次元集積化技術に関する研究 コウミツド ジッソウ ノ タメ ノ 3ジゲン シュウセキカ ギジュツ ニ カンスル ケンキュウ
Degree grantor/type
早稲田大学