Advanced materials for thermal management of electronic packaging

• Material Type: 図書
• ISBN: 9781441977588 (hbk); 1441977589 (hbk)
• ISBN (error code): 9781441977595 (ebk)
• ISSN (series): 1437-0387
• Title: Advanced materials for thermal management of electronic packaging
• Author/Editor: Xingcun Colin Tong.
• Series Title: Springer series in advanced microelectronics ; 30
• Title Heading: Springer series in advanced microelectronics ; 30.
• Author Heading: Tong, Xingcun Colin.
• Publication, Distribution, etc.: New York : Springer; London : Springer
• Publication Date: c2011.
• Publication Date (W3CDTF): 2011
• Extent: xxi, 616 p.
• Other physical details: ill. (some col.)
• Size: 25 cm.
• Place of Publication (Country Code): US
• Text Language Code: eng
• Subject Heading: Electronic apparatus and appliances--Temperature control.; Electronic packaging--Materials.
• LCC: TK7870.15
• DDC: 621.381
• NDLC: ND416
• Target Audience: 一般
• Note (Bibliography): Includes bibliographical references and index.
• Holding library: 国立国会図書館
• Call No.: ND416-B46
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 023112512; http://id.ndl.go.jp/bib/023112512
• LC Control Number: 2011377399; https://lccn.loc.gov/2011377399
• OCLC No.: 706348922; https://www.worldcat.org/oclc/706348922
• Bibliographic Record Category (NDL): 211

• Contents: Thermal management fundamentals and design guides in electronic packagingCharacterization methodologies of thermal management materialsElectronic pack...