Advanced materials for thermal management of electronic packaging (Springer series in advanced microelectronics ; 30)

Advanced materials for thermal management of electronic packaging

(Springer series in advanced microelectronics ; 30)

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Contents：: Thermal management fundamentals and design guides in electronic packagingCharacterization methodologies of thermal management materialsElectronic pack...

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Material Type: 図書
ISBN: 9781441977588 (hbk)
1441977589 (hbk)
ISBN (error code): 9781441977595 (ebk)
ISSN (series): 1437-0387
Title: Advanced materials for thermal management of electronic packaging
Author/Editor: Xingcun Colin Tong.
Series Title: Springer series in advanced microelectronics ; 30
Title Heading: Springer series in advanced microelectronics ; 30.
Author Heading: Tong, Xingcun Colin.
Publication, Distribution, etc.: New York : Springer
London : Springer
Publication Date: c2011.
Publication Date (W3CDTF): 2011
Extent: xxi, 616 p.
Other physical details: ill. (some col.)
Size: 25 cm.
Place of Publication (Country Code): US
Text Language Code: eng
Subject Heading: Electronic apparatus and appliances--Temperature control.
Electronic packaging--Materials.
LCC: TK7870.15
DDC: 621.381
NDLC: ND416
Target Audience: 一般
Note (Bibliography): Includes bibliographical references and index.
Holding library: 国立国会図書館
Call No.: ND416-B46
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 023112512
http://id.ndl.go.jp/bib/023112512
LC Control Number: 2011377399
https://lccn.loc.gov/2011377399
OCLC No.: 706348922
https://www.worldcat.org/oclc/706348922
Bibliographic Record Category (NDL): 211