Advances in CMP/polishing technologies for the manufacture of electronic devices

• Material Type: 図書
• ISBN: 9781437778595; 1437778593
• Title: Advances in CMP/polishing technologies for the manufacture of electronic devices
• Author/Editor: edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa.
• Author Heading: 土肥, 俊郎, 1947- ドイ, トシロウ, 1947- ( 00413159 )Authorities; Marinescu, Ioan D.; Kurokawa, Syūhei. [黒河周平]
• Publication, Distribution, etc.: Oxford : William Andrew; New York : William Andrew
• Publication Date: 2012.
• Publication Date (W3CDTF): 2012
• Extent: xii, 317 p.
• Other physical details: ill.
• Size: 24 cm.
• Alternative Title: CMP polishing technologies for the manufacture of electronic devices
• Place of Publication (Country Code): GB
• Text Language Code: eng
• Subject Heading: Grinding and polishing.; Chemical mechanical planarization.; Electrolytic polishing.
• LCC: TJ1280
• DDC: 667/.72
• NDLC: NB55
• Target Audience: 一般
• Note (Bibliography): Includes bibliographical references and index.
• Collection (particular): 日本関係外国語図書
• Holding library: 国立国会図書館
• Call No.: NB55-B4
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 023569890; http://id.ndl.go.jp/bib/023569890
• LC Control Number: 2012359712; https://lccn.loc.gov/2012359712
• OCLC No.: 740631119; https://www.worldcat.org/oclc/740631119
• Bibliographic Record Category (NDL): 211

• Summary, etc.: CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover...