Packaging of high power semiconductor lasers

• Material Type: 図書
• ISBN: 1461492629 (print); 9781461492627 (print); 9781461492634 (ebook); 1461492637 (ebook)
• Title: Packaging of high power semiconductor lasers
• Author/Editor: Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu.
• Series Title: Micro- and Opto-Electronic Materials, Structures, and Systems
• Title Heading: Micro- and opto-electronic materials, structures, and systems.
• Author Heading: Liu, Xingsheng.
• Publication, Distribution, etc.: New York : Springer (出版)
• Publication Date: [2015]; 著作権日付 : ©2015
• Publication Date (W3CDTF): 2015
• Extent: xv, 402 pages
• Other physical details: illustrations, photographs
• Size: 24 cm.
• Place of Publication (Country Code): US
• Text Language Code: eng
• Content Type: text
• Media Type: unmediated
• Carrier Type: volume
• Subject Heading: Lasers--Congresses.; Semiconductor lasers.; Electronic packaging.
• LCC: TA1673
• DDC: 621.366
• NDLC: ND451
• Target Audience: 一般
• Note (Bibliography): Includes bibliographical references at the end of each chapters and index.
• Holding library: 国立国会図書館
• Call No.: ND451-B55
• Related Material (DOI): 10.1007/978-1-4614-9263-4
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 026520189; http://id.ndl.go.jp/bib/026520189
• Cataloging Rule: RDA
• Bibliographic Record Category (NDL): 211

• Contents: Introduction of High Power Semiconductor LasersOverview of High Power Semiconductor Laser PackagesThermal Design and Management in High Power Semicond...
• Summary, etc.: This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processi...