Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2015-- : presented at ASME 2015 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : July 6-9, 2015 : San Francisco, California, USA : InterPACK : InterPACK/ICNMM : InterPACK2015 : Jul 2015, San Francisco, CA.

• Material Type: 図書
• ISBN: 9780791856888 (v. 1); 9780791856895 (v. 2); 9780791856901 (v. 3)
• Title: Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2015-- : presented at ASME 2015 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : July 6-9, 2015 : San Francisco, California, USA : InterPACK : InterPACK/ICNMM : InterPACK2015 : Jul 2015, San Francisco, CA.
• Author Heading: creator. ： ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2015 : San Francisco, California, USA); contributor. ： International Conference on Nanochannels, Microchannels and Minichannels (13th : 2015 : San Francisco, California)
• Publication, Distribution, etc.: New York, N.Y. : The American Society of Mechanical Engineers (出版)
• Publication Date: [2015]
• Publication Date (W3CDTF): 2015
• Extent: 3 volumes
• Other physical details: illustrations
• Size: 28 cm
• Alternative Title: 2015 proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : IPACK2015
• Place of Publication (Country Code): US
• Text Language Code: eng
• Genre/Form Terms: Conference papers and proceedings.
• Content Type: text
• Media Type: unmediated
• Carrier Type: volume
• Subject Heading: Electronic packaging--Congresses.; Electronic packaging.
• LCC: TK7870.15
• NDLC: M17
• Target Audience: 一般
• Note (General): Papers.; "This is the first time that the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) and the International Conference on Nanochannels, Microchannels and Minichannels (ICNMM) will jointly hold their conferences together."--Welcome message.; "It was renamed InterPACK in 1995, and has been occurring biannually since then."--Welcome message.
• Note (Bibliography): Includes bibliographical references and author indexes.
• Holding library: 国立国会図書館
• Call No.: M17-16-1112
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 027107714; http://id.ndl.go.jp/bib/027107714
• OCLC No.: 936497429; https://www.worldcat.org/oclc/936497429
• Cataloging Rule: RDA
• Bibliographic Record Category (NDL): 215

• Contents: v. 1. Thermal managementv. 2. Advanced electronics and photonics, packaging materials and processing ; Advanced electronics and photonics: packaging, ...