3D microelectronic packaging : from fundamentals to applications

• Material Type: 図書
• ISBN: 9783319445847 (print); 9783319445861 (electronic bk.)
• ISSN (series): 1437-0387
• Title: 3D microelectronic packaging : from fundamentals to applications
• Author/Editor: Yan Li, Deepak Goyal, editors.
• Series Title: Springer series in advanced microelectronics ; volume 57
• Title Heading: Springer series in advanced microelectronics ; 57.
• Author Heading: Li, Yan.; Goyal, Deepak. (Electrical engineer)
• Publication, Distribution, etc.: Cham, Switzerland : Springer (出版)
• Publication Date: 2017.
• Publication Date (W3CDTF): 2017
• Extent: ix, 463 pages
• Size: 25 cm.
• Place of Publication (Country Code): CH
• Text Language Code: eng
• Content Type: text
• Media Type: unmediated
• Carrier Type: volume
• Subject Heading: Microelectronics--Packaging.
• LCC: TK7874
• DDC: 621.381
• NDLC: ND354
• Target Audience: 一般
• Note (Bibliography): Includes bibliographical references and index.
• Holding library: 国立国会図書館
• Call No.: ND354-B6
• Related Material (DOI): 10.1007/978-3-319-44586-1
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 027642259; http://id.ndl.go.jp/bib/027642259
• Cataloging Rule: RDA
• Bibliographic Record Category (NDL): 211

• Contents: Introduction to 3D Microelectronic Packaging3D packaging architecture and assembly process designMaterials and Processing of TSV...
• Summary, etc.: This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing d...