3D microelectronic packaging : from architectures to applications

• Material Type: 図書
• ISBN: 9789811570896; 9789811570902 electronic book; 9811570906 electronic book
• ISSN (series): 1437-0387
• Title: 3D microelectronic packaging : from architectures to applications
• Author/Editor: Yan Li, Deepak Goyal, editors
• Edition: Second edition
• Series Title: Springer series in advanced microelectronics ; volume 64
• Title Heading: Springer series in advanced microelectronics ; 64. 1437-0387
• Author Heading: Li, Yan; Goyal, Deepak (Electrical engineer)
• Publication, Distribution, etc.: Singapore : Springer (出版)
• Publication Date: [2021]
• Publication Date (W3CDTF): 2021
• Extent: xvii, 622 pages
• Size: 25 cm
• Alternative Title: Three Dimensional microelectronic packaging
• Place of Publication (Country Code): SG
• Text Language Code: eng
• Content Type: text
• Media Type: unmediated
• Carrier Type: volume
• Subject Heading: Microelectronics--Packaging; Electronic circuits; Electronics; Optical materials; Electronics--Materials; Biotechnology; Nanotechnology; Metals; Biotechnology.; Electronic circuits.; Electronics.; Electronics--Materials.; Engineering.; Metals.; Microelectronics.; Nanotechnology.; Optical materials.
• LCC: TK7874
• DDC: 621.3815
• NDLC: ND354
• Target Audience: 一般
• Note (Bibliography): Includes bibliographical references and index
• Holding library: 国立国会図書館
• Call No.: ND354-D2
• Related Material (DOI): 10.1007/978-981-15-7090-2
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 030753862; http://id.ndl.go.jp/bib/030753862
• Cataloging Rule: RDA
• Bibliographic Record Category (NDL): 211

• Contents: 1. Introduction to 3D microelectronic packaging2. 3D packaging architecture and assembly process design3. Fundamentals of TSV processing and reliabili...
• Summary, etc.: This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, arc...