図書

3D microelectronic packaging : from architectures to applications Second edition (Springer series in advanced microelectronics ; volume 64)

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3D microelectronic packaging : from architectures to applications

Second edition

(Springer series in advanced microelectronics ; volume 64)

Call No. (NDL)
ND354-D2
Bibliographic ID of National Diet Library
030753862
Material type
図書
Author
Yan Li, Deepak Goyal, editors
Publisher
Springer
Publication date
[2021]
Material Format
Paper
Capacity, size, etc.
xvii, 622 pages ; 25 cm
NDC
-
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Detailed bibliographic record

Contents：

1. Introduction to 3D microelectronic packaging2. 3D packaging architecture and assembly process design3. Fundamentals of TSV processing and reliabili...

Summary, etc.：

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, arc...

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Bibliographic Record

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Paper

Material Type
図書
ISBN
9789811570896
9789811570902 electronic book
9811570906 electronic book
ISSN (series)
1437-0387
Title
3D microelectronic packaging : from architectures to applications
Author/Editor
Yan Li, Deepak Goyal, editors
Edition
Second edition
Series Title
Springer series in advanced microelectronics ; volume 64
Title Heading
Springer series in advanced microelectronics ; 64. 1437-0387
Author Heading
Li, Yan
Goyal, Deepak (Electrical engineer)
Publication, Distribution, etc.
Singapore : Springer (出版)