Microelectronics failure analysis : desk reference

• Material Type: 図書
• ISBN: 9781627082457 (print); 162708245X (print); 9781627082464 (pdf); 9781627082471 (electronic)
• Title: Microelectronics failure analysis : desk reference
• Author/Editor: edited by Tejinder Gandhi
• Edition: Seventh edition
• Author Heading: Gandhi, Tejinder
• Publication, Distribution, etc.: Materials Park, OH : ASM International (出版)
• Publication Date: [2019]; 著作権日付 : ©2019
• Publication Date (W3CDTF): 2019
• Extent: xi, 705 pages
• Other physical details: illustrations (some color)
• Size: 29 cm
• Place of Publication (Country Code): US
• Text Language Code: eng
• Genre/Form Terms: Handbooks and manuals.
• Content Type: text
• Media Type: unmediated
• Carrier Type: volume
• Subject Heading: Electronics--Materials--Testing--Handbooks, manuals, etc; Microelectronics--Materials--Testing--Handbooks, manuals, etc; Microelectronics--Materials--Defects--Handbooks, manuals, etc; Electronic apparatus and appliances--Testing--Handbooks, manuals, etc; Semiconductors--Defects--Handbooks, manuals, etc; Electronic apparatus and appliances--Testing.; Electronics--Materials--Testing.; Microelectronics--Materials--Defects.; Microelectronics--Materials--Testing.; Semiconductors--Defects.
• LCC: TK7871
• DDC: 621.381
• NDLC: ND371
• Target Audience: 一般
• Note (General): "An ASM materials solutions publication"; "EDFAS, Electronic Device Failure Analysis Society, ASM International"
• Note (Bibliography): Includes bibliographical references and indexes
• Holding library: 国立国会図書館
• Call No.: ND371-D19
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 031436669; http://id.ndl.go.jp/bib/031436669
• LC Control Number: 2019951107; https://lccn.loc.gov/2019951107
• OCLC No.: 1126332918; https://www.worldcat.org/oclc/1126332918
• Cataloging Rule: RDA
• Bibliographic Record Category (NDL): 211

• Contents: section 1. Failure analysis process and management. Overview of wafer-level electrical failure analysis process for accelerated yield engineering / S....