Advanced 3D interconnect technologies and packaging. (ECS Transactions ; 109 (no. 2))

Advanced 3D interconnect technologies and packaging.

(ECS Transactions ; 109 (no. 2))

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Material Type: 図書
ISBN: 9781713863458
Title: Advanced 3D interconnect technologies and packaging.
Series Title: ECS Transactions ; 109 (no. 2)
Publication, Distribution, etc.: Pennington, NJ, USA : The Electrochemical Society (出版)
Publication Date: [2022]
Publication Date (W3CDTF): 2022
Extent: 52 pages
Size: 24 cm.
Alternative Title: Dielectric science and materials
Additional Title: international symposium on advanced 3D interconnect technologies and packaging : 242nd meeting of the Electrochemical Society : half-day tutorial on semiconductor advanced packaging : Oct 2022, Atlanta, GA.
Place of Publication (Country Code): US
Text Language Code: eng
Content Type: text
Media Type: unmediated
Carrier Type: volume
NDLC: M17
Target Audience: 一般
Note (General): Papers.
Note (Bibliography): Includes bibliographical references and author index.
Holding library: 国立国会図書館
Call No.: M17-23-273
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 032654700
http://id.ndl.go.jp/bib/032654700
Cataloging Rule: RDA
Bibliographic Record Category (NDL): 215