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図書

Advanced 3D interconnect technologies and packaging : international symposium on advanced 3D interconnect technologies and packaging : 242nd meeting of the Electrochemical Society : half-day tutorial on semiconductor advanced packaging : Oct 2022, Atlanta, GA. (ECS Transactions ; 109 (no. 2))

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Advanced 3D interconnect technologies and packaging : international symposium on advanced 3D interconnect technologies and packaging : 242nd meeting of the Electrochemical Society : half-day tutorial on semiconductor advanced packaging : Oct 2022, Atlanta, GA.

(ECS Transactions ; 109 (no. 2))

Call No. (NDL)
M17-23-273
Bibliographic ID of National Diet Library
032654700
Material type
図書
Author
-
Publisher
The Electrochemical Society
Publication date
[2022]
Material Format
Paper
Capacity, size, etc.
52 pages ; 24 cm.
NDC
-
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Paper

Material Type
図書
ISBN
9781713863458
Title
Advanced 3D interconnect technologies and packaging : international symposium on advanced 3D interconnect technologies and packaging : 242nd meeting of the Electrochemical Society : half-day tutorial on semiconductor advanced packaging : Oct 2022, Atlanta, GA.
Series Title
ECS Transactions ; 109 (no. 2)
Publication, Distribution, etc.
Pennington, NJ, USA : The Electrochemical Society (出版)
Publication Date
[2022]
Publication Date (W3CDTF)
2022
Extent
52 pages
Size
24 cm.
Alternative Title
Dielectric science and materials