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図書

次世代高速・高周波伝送部材の開発動向

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次世代高速・高周波伝送部材の開発動向

Call No. (NDL)
ND541-R4
Bibliographic ID of National Diet Library
033864460
Material type
図書
Author
技術情報協会 企画編集
Publisher
技術情報協会
Publication date
2024.12
Material Format
Paper
Capacity, size, etc.
600 p ; 31 cm
NDC
547.3
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Detailed bibliographic record

Summary, etc.:

■ 本書のポイント【低誘電損失材料の開発事例】【微細回路形成と密着性向上】【半導体パッケージ基板材料の開発事例】【Co-Packaged Opticsと集積化技術】(Provided by: 出版情報登録センター(JPRO))

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Table of Contents

Provided by:国立国会図書館Link to Help Page
  • 目次

  • 第1章 高速通信用プリント配線板材料の開発動向と配線形成

  • 第1節 高速大容量伝送向けプリント基板の最新動向と高周波・低伝送損失化/ 3

  • はじめに/ 3

  • 1. 高速大容量伝送のトレンドとプリント基板の基礎知識/ 3

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Paper

Material Type
図書
ISBN
978-4-86798-054-5
Title Transcription
ジセダイ コウソク ・ コウシュウハ デンソウ ブザイ ノ カイハツ ドウコウ
Author/Editor
技術情報協会 企画編集
Author Heading
編者 : 技術情報協会 ギジュツ ジョウホウ キョウカイ ( 00893204 )Authorities
Publication, Distribution, etc.
Publication Date
2024.12
Publication Date (W3CDTF)
2024
Extent
600 p