博士論文
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積層型機能性デバイスに向けたハイブリッド接合技術に関する研究

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積層型機能性デバイスに向けたハイブリッド接合技術に関する研究

Persistent ID (NDL)
info:ndljp/pid/10211427
Material type
博士論文
Author
Nimura, Masatsuguほか
Publisher
-
Publication date
2015
Material Format
Digital
Capacity, size, etc.
-
Name of awarding university/degree
早稲田大学,博士(工学)
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Notes on use

Note (General):

早大学位記番号:新7201

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Digital

Material Type
博士論文
Author/Editor
Nimura, Masatsugu
仁村, 将次
Publication Date
2015
Publication Date (W3CDTF)
2015
Alternative Title
Hybrid bonding technology for 3D integrated functional devices
Degree grantor/type
早稲田大学
Date Granted
2016-03-15
Date Granted (W3CDTF)
2016-03-15