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第 1 部 (2) ...

第 1 部 (2) 半導体集積回路における微細金属薄膜配線の断線故障予測

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第 1 部 (2) 半導体集積回路における微細金属薄膜配線の断線故障予測

Persistent ID (NDL)
info:ndljp/pid/10351208
Material type
記事
Author
笹川,和彦ほか
Publisher
日本機械学会
Publication date
2003-03-27
Material Format
Digital
Journal name
材料力学部門春のシンポジウム講演論文集 2003
Publication Page
p.7-10
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Note (General):

著者所属: 弘前大著者所属: 東北大Affiliation: Hirosaki University...

Detailed bibliographic record

Summary, etc.:

Recently, a governing parameter for electromigration damage in passivated polycrystalline lines, (AFD)^*_<gen>, was formulated. The new parameter prop...

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Digital

Material Type
記事
Author/Editor
笹川,和彦
長谷川,昌孝
坂,真澄
阿部,博之
Publication, Distribution, etc.
Publication Date
2003-03-27
Publication Date (W3CDTF)
2003-03-27
Alternative Title
Prediction of Electromigration Failure in Passivated Polycrystalline Lines in IC
Periodical title
材料力学部門春のシンポジウム講演論文集
No. or year of volume/issue
2003
Volume
2003