産業用トランスファモールド封止型パワーモジュール技術
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- Material Type
- 記事
- Author/Editor
- 岡誠次後藤晶子井高志織
- Publication, Distribution, etc.
- Publication Date
- 2012-05
- Publication Date (W3CDTF)
- 2012-05
- Alternative Title
- The transfer-molded packaging technology for industrial power modules
- Periodical title
- 三菱電機技報
- No. or year of volume/issue
- 86(5)
- Volume
- 86(5)