薄型半導体パッケージ用低熱膨張基板材料
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- Material Type
- 記事
- Title
- Author/Editor
- 高橋龍史元部英次花崎正平
- Publication, Distribution, etc.
- Publication Date
- 2011-03
- Publication Date (W3CDTF)
- 2011-03
- Alternative Title
- Low thermal expansion materials for thin IC package substrates
- Periodical title
- パナソニック電工技報
- No. or year of volume/issue
- 59(1)
- Volume
- 59(1)