鉛フリーはんだ対応の高耐熱・低誘電正接基板材料
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- Material Type
- 記事
- Author/Editor
- 田宮裕記藤澤洋之中村善彦
- Publication, Distribution, etc.
- Publication Date
- 2008-06
- Publication Date (W3CDTF)
- 2008-06
- Alternative Title
- High heat resistance, low Df PC board material compatible for lead free solder
- Periodical title
- 松下電工技報
- No. or year of volume/issue
- 56(2)
- Volume
- 56(2)