超音波フリップチップ実装技術の開発
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- Material Type
- 記事
- Title
- Author/Editor
- 谷元昭渡辺弘道西村明彦
- Publication, Distribution, etc.
- Publication Date
- 2009-12
- Publication Date (W3CDTF)
- 2009-12
- Alternative Title
- Development of ultrasonic flip chip bonding technology
- Periodical title
- 富士通テン技報
- No. or year of volume/issue
- (54)
- Volume
- (54)