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樹脂パッドと電界砥粒制御技術を適用した先進結晶材基板の低ダメージ機械研磨技術に関する研究
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国立国会図書館デジタルコレクション
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DOI[10.20569/00004751]to the data of the same series
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2023-09-05 再収集
2023-09-05 再収集
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- Material Type
- 博士論文
- Author/Editor
- 千葉, 翔悟
- Author Heading
- Publication, Distribution, etc.
- Publication Date
- 2019-12-26
- Publication Date (W3CDTF)
- 2019-12-26
- Alternative Title
- Study on damage-less mechanical polishing technique for advanced crystal substrates using a resin pad and electric field-assisted polishing
- Degree grantor/type
- 秋田大学
- Date Granted
- 2019-12-26