本資料は、掲載誌(URI)等のリンク先にある学位授与機関のWebサイトやCiNii Dissertationsから、本文を自由に閲覧できる場合があります。
Sn-3.0Ag-0.5Cuはんだを用いたギ酸雰囲気中のフラックスレスはんだ付
Available in National Diet Library
Find on the publisher's website
国立国会図書館デジタルコレクション
Digital data available
Check on the publisher's website
DOI[10.18910/76572]to the data of the same series
Search by Bookstore
Read this material in an accessible format.
Table of Contents
2021-05-28 再収集
2021-05-28 再収集
2022-11-07 再収集
2022-11-07 再収集
Holdings of Libraries in Japan
This page shows libraries in Japan other than the National Diet Library that hold the material.
Please contact your local library for information on how to use materials or whether it is possible to request materials from the holding libraries.
other
OUKA (Osaka University Knowledge Archive)
DigitalYou can check the holdings of institutions and databases with which Institutional Repositories DataBase(IRDB)(Institutional Repository) is linked at the site of Institutional Repositories DataBase(IRDB)(Institutional Repository).
Search by Bookstore
Read in Disability Resources
- Other Services
Bibliographic Record
You can check the details of this material, its authority (keywords that refer to materials on the same subject, author's name, etc.), etc.
- Material Type
- 博士論文
- Title Transcription
- Sn-3.0Ag-0.5Cuハンダヲモチイタギサンフンイキチュウノフラックスレスハンダヅケ
- Author/Editor
- 何, 思亮
- Author Heading
- Publication Date
- 2020-03-25
- Publication Date (W3CDTF)
- 2020-03-25
- Alternative Title
- Fluxless soldering under a formic acid atmosphere using Sn-3.0Ag-0.5Cu solder
- Degree grantor/type
- 大阪大学
- Date Granted
- 2020-03-25