応力緩和ダイアタッチ構造によるパワー半導体モジュールの高温信頼性向上に関する研究
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国立国会図書館デジタルコレクション
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DOI[10.18910/85385]to the data of the same series
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- Material Type
- 博士論文
- Title Transcription
- オウリョクカンワダイアタッチコウゾウニヨルパワーハンドウタイモジュールノコウオンシンライセイニカンスルケンキュウ
- Author/Editor
- 伊藤, 宏文
- Author Heading
- Publication Date
- 2021-09-24
- Publication Date (W3CDTF)
- 2021-09-24
- Alternative Title
- オウリョクカンワダイアタッチコウゾウニヨルパワーハンドウタイモジュールノコウオンシンライセイニカンスルケンキュウ
- Degree grantor/type
- 大阪大学
- Date Granted
- 2021-09-24