博士論文
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Mechanical Reliability of Sintered Nano Silver for Power Device Packaging

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Mechanical Reliability of Sintered Nano Silver for Power Device Packaging

Persistent ID (NDL)
info:ndljp/pid/12886473
Material type
博士論文
Author
若本, 恵佑ほか
Publisher
-
Publication date
2023-03-22
Material Format
Digital
Capacity, size, etc.
-
Name of awarding university/degree
京都先端科学大学,博士(工学)
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Note (General):

2022年度

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  • Kyoto University of Advanced Science Academic Repository

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Digital

Material Type
博士論文
Author/Editor
若本, 恵佑
Wakamoto, Keisuke
Publication Date
2023-03-22
Publication Date (W3CDTF)
2023-03-22
Alternative Title
Mechanical Reliability of Sintered Nano Silver for Power Device Packaging
Degree grantor/type
京都先端科学大学
Date Granted
2023-03-22
Date Granted (W3CDTF)
2023-03-22