Time-resolved spectroscopy of glass ablation during micro-via processing using 248 nm excimer laser for semiconductor interposer packaging
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DOI[10.2961/jlmn.2022.03.2001]to the data of the same series
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- Material Type
- 記事
- Author/Editor
- Yasufumi KawasujiYasuhiro AdachiKazuhiko Moro
- Publication, Distribution, etc.
- Publication Date
- 2022-12
- Publication Date (W3CDTF)
- 2022-12
- Periodical title
- Journal of laser micro/nanoengineering
- No. or year of volume/issue
- 17(3)
- Volume
- 17(3)
- ISSN (Periodical Title)
- 1880-0688