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博士論文

Development of critical process technologies for wafer-level high vacuum packaging based on silicon migration sealing

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Development of critical process technologies for wafer-level high vacuum packaging based on silicon migration sealing

Persistent ID (NDL)
info:ndljp/pid/13776382
Material type
博士論文
Author
Gong, Tianjiao
Publisher
Gong, Tianjiao
Publication date
2023
Material Format
Digital
Capacity, size, etc.
-
Name of awarding university/degree
東北大学,博士(工学)
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Digital

Material Type
博士論文
Title
Development of critical process technologies for wafer-level high vacuum packaging based on silicon migration sealing
Author/Editor
Gong, Tianjiao
Publication, Distribution, etc.
Gong, Tianjiao
Publication Date
2023
Publication Date (W3CDTF)
2023
Alternative Title
シリコンマイグレーションシーリングによるウェーハレベル高真空パッケージングのための重要プロセス技術の開発
Degree grantor/type
東北大学
Date Granted
2023-09-25
Date Granted (W3CDTF)
2023-09-25