博士論文

Electromigration and mechanical reliability improvement of Pb-free SABI solder joint with refined microstructure

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Electromigration and mechanical reliability improvement of Pb-free SABI solder joint with refined microstructure

Persistent ID (NDL)
info:ndljp/pid/9516368
Material type
博士論文
Author
金, 永錫
Publisher
金, 永錫
Publication date
2014
Material Format
Digital
Capacity, size, etc.
-
Name of awarding university/degree
大阪大学,博士(工学)
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Material Type
博士論文
Title
Electromigration and mechanical reliability improvement of Pb-free SABI solder joint with refined microstructure
Author/Editor
金, 永錫
Publication, Distribution, etc.
金, 永錫
Publication Date
2014
Publication Date (W3CDTF)
2014
Alternative Title
鉛フリーSABIはんだ接合の組織微細化によるエレクトロマイグレーションと機械的特性の改善
Degree grantor/type
大阪大学
Date Granted
2014-09-25
Date Granted (W3CDTF)
2014-09-25