Proceedings of the Second International Symposium on Chemical Mechanical Planariarization [sic] in Integrated Circuit Device Manufacturing

Material type: 図書

Author: editors, S. Raghavan, R.L. Opila, L. Zhang ; Electronics and Dielectric Science and Technology Divisions [of the Electrochemical Society]

Publisher: Electrochemical Society

Publication date: c1998

Material Format: Paper

Capacity, size, etc.: 23 cm

NDC: -

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Note (General)：: "Electronics and Dielectric Science and Technology Divisions.""This volume contains most of the papers presented at the Second International Symposium...

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Paper

Material Type: 図書
ISBN: 156677201X
Title: Proceedings of the Second International Symposium on Chemical Mechanical Planariarization [sic] in Integrated Circuit Device Manufacturing
Author/Editor: editors, S. Raghavan, R.L. Opila, L. Zhang ; Electronics and Dielectric Science and Technology Divisions [of the Electrochemical Society]
Author Heading: International Symposium on Chemical Mechanical Planarization
https://ci.nii.ac.jp/author/DA10888875
Raghavan, S. (Srini)
https://ci.nii.ac.jp/author/DA10888897
Opila, Robert Leon
https://ci.nii.ac.jp/author/DA12254039
Zhang, L.
Electrochemical Society. Electronics Division
https://ci.nii.ac.jp/author/DA0357072X
Electrochemical Society. Dielectric Science and Technology Division
https://ci.nii.ac.jp/author/DA06421624
Electrochemical Society. Meeting
https://ci.nii.ac.jp/author/DA03398898
Publication, Distribution, etc.: Electrochemical Society
Publication Date: c1998
Publication Date (W3CDTF): 1998
Size: 23 cm
Alternative Title: Chemical mechanical planarization in integrated circuit device manufacturing
Place of Publication (Country Code): us
Text Language Code: en
Subject Heading: Microelectronics -- Materials Congresses
Grinding and polishing Congresses
Metals -- Pickling Congresses
Semiconductors -- Surfaces Congresses
LCC: TK7871
Target Audience: 一般
Note (General): "Electronics and Dielectric Science and Technology Divisions."
"This volume contains most of the papers presented at the Second International Symposium on Chemical Mechanical Planarization (CMP) in Integrated Circuit (IC) Device Manufacturing held at the 193rd Annual Meeting of Electrochemical Society in San Diego during May 5-7, 1998."
Includes bibliographical references and indexes
Related Material: Proceedings
https://cir.nii.ac.jp/crid/1130282269273401728
Related Material (URI): https://ci.nii.ac.jp/ncid/BA4328413X#entity
https://lccn.loc.gov/99196375
Periodical Title: Proceedings
https://cir.nii.ac.jp/crid/1130282269273401728
Data Provider (Database): 国立情報学研究所 : CiNii Research
Original Data Provider (Database): CiNii Books
https://ci.nii.ac.jp/books
NCID: https://ci.nii.ac.jp/ncid/BA4328413X : BA4328413X
LC Control Number: 99196375
https://lccn.loc.gov/99196375