EMAP 2005 : 2005 International Symposium on Electronics Materials and Packaging : December 11-14, 2005, Tokyo Institute of Technology, Tokyo, Japan

Material type: 図書

Author: International Symposium on Electronics Materials and Packagingほか

Publisher: IEEE

Publication date: c2005

Material Format: Paper

Capacity, size, etc.: 30 cm

NDC: -

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Notes on use

Note (General)：: Sponsors: COE21, Tokyo Institute of Technology, CASIO Science Promotion Foundation, The Kao Foundation for Arts and SciencesGeneral Chair: Kikuo Kishi...

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Paper

Material Type: 図書
Title: EMAP 2005 : 2005 International Symposium on Electronics Materials and Packaging : December 11-14, 2005, Tokyo Institute of Technology, Tokyo, Japan
Author Heading: International Symposium on Electronics Materials and Packaging
岸本, 喜久雄キシモト, キクオ
https://ci.nii.ac.jp/author/DA14456511
Publication, Distribution, etc.: IEEE
Publication Date: c2005
Publication Date (W3CDTF): 2005
Size: 30 cm
Alternative Title: Proceedings : EMAP 2005 : 2005 International Symposium on Electronics Materials and Packaging, December 11-14, 2005, Tokyo Institute of Technology, Tokyo, Japan
7th International Conference on Electronics Materials and Packaging
EMAP '05
Place of Publication (Country Code): us
Text Language Code: en
LCC: MLCM 2006/07677 (T)
Target Audience: 一般
Note (General): Sponsors: COE21, Tokyo Institute of Technology, CASIO Science Promotion Foundation, The Kao Foundation for Arts and Sciences
General Chair: Kikuo Kishimoto
"The 7th International Conference on Electronics Materials and Packaging ..." -- on pref
IEEE catalog number: 05EX1277
Related Material (URI): https://ci.nii.ac.jp/ncid/BA83240388#entity
https://lccn.loc.gov/2006276755
Data Provider (Database): 国立情報学研究所 : CiNii Research
Original Data Provider (Database): CiNii Books
https://ci.nii.ac.jp/books
NCID: https://ci.nii.ac.jp/ncid/BA83240388 : BA83240388
LC Control Number: 2006276755
https://lccn.loc.gov/2006276755