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ECS transactions

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ECS transactions

Material type
図書
Author
Electrochemical Society
Publisher
The Electrochemical Society
Publication date
-
Material Format
Paper
Capacity, size, etc.
23 cm
NDC
-
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Notes on use

Note (General):

Formerly: Electrochemical Society proceedings series

Related materials as well as pre- and post-revision versions

ULSI process integration 5Leave the NDL website. State-of-the-art program on compound semiconductors 47 (SOTAPOCS 47) and wide-bandgap semiconductor materials and devices 8Leave the NDL website. Molten salts 15 : in memory of Robert OsteryoungLeave the NDL website. Solid oxide fuel cells 10 (SOFC-X)Leave the NDL website. Copper interconnects, new contact and barrier metallurgies/structures, and low-k interlevel dielectrics III : at the 208th ECS meeting, October 16-21, 2005, Los Angeles, California, USALeave the NDL website. Durability and reliability of low-temperature fuel cells systemsLeave the NDL website. Porous semiconductors : a symposium held in memory of Vitali Parkhutik and Volker LehmannLeave the NDL website. Thin Film Transistor Technology 8Leave the NDL website. State-of-the-art program on compound semiconductors 46 (SOTAPOCS 46) and processes at the semiconductor/solution interface 2Leave the NDL website. Semiconductor Wafer Bonding : Science, Technology, and ApplicationsLeave the NDL website. ZnO based thin films, nano-wires, and nano-belts for photonic and electronic devices and sensorsLeave the NDL website. SiGe and Ge, materials, processing, and devicesLeave the NDL website. Advanced gate stack, source/drain and channel engineering for Si-based CMOS 3 : new materials, processes and equipmentLeave the NDL website. Electrochemistry in mineral and metal processing VIILeave the NDL website. Physics and Chemistry of SiO2 and the Si-SiO2 Interface-5Leave the NDL website. Atomic layer deposition applicationsLeave the NDL website. Dielectrics for nanosystems II: materials science, processing, reliability, and manufacturingLeave the NDL website. 30th fuel cell seminarLeave the NDL website. Physics and technology of high-k gate dielectricsLeave the NDL website. Physics and technology of high-k materials 9Leave the NDL website. Advanced gate stack, source/drain and channel engineering for Si-based CMOS 2: new materials, processes, and equipmentLeave the NDL website. Microelectronics Technology and Devices : SBMICRO 2007Leave the NDL website. Chemical Sensors 7 and MEMS/NEMS 7Leave the NDL website. Silicon materials science and technology XLeave the NDL website. Critical factors in localized corrosion 5 : a symposium in honor of Hugh IsaacsLeave the NDL website. SiGe, Ge, and related compounds : materials, processing, and devicesLeave the NDL website. Advanced gate stack, source/drain, and channel engineering for si-based CMOS 6 : new materials, processes, and equipmentLeave the NDL website. Dielectrics for nanosystems 4 : materials science, processing, reliability, and manufacturingLeave the NDL website. Microelectronics Technology and Devices : SBMICRO 2006Leave the NDL website. Corrosion protective coatings and inhibitors : at the 208th ECS Meeting, October 16-21, 2005, Los Angeles, California, USALeave the NDL website. Proton exchange membrane fuel cellsLeave the NDL website. State-of-the-art program on compound semiconductors 45 (SOTAPOCS 45) and wide bandgap semiconductor materials and devices 7Leave the NDL website. State-of-the-Art Program on Compound Semiconductors (SOTAPOCS XLIII) and Nitride and Wide Bandgap Semiconductors for Sensors, Photonics, and Electronics VILeave the NDL website. Cleaning and surface conditioning technology in semiconductor device manufacturing 10Leave the NDL website. ULSI process integration 7Leave the NDL website. State-of-the-Art Program on Compound Semiconductors 49 (SOTAPOCS 49) and Nitrides and Wide-Bandgap Semiconductors for Sensors, Photonics, and Electronics 9Leave the NDL website. Corrosion and electrochemistry of advanced materials, in Honor of Koji HashimotoLeave the NDL website. Dielectrics for nanosystems 3: materials science, processing, reliability, and manufacturingLeave the NDL website. Fuel cell ceminar 2007Leave the NDL website. High Purity Silicon 11Leave the NDL website. Advanced gate stack, source/drain and channel engineering for Si-based CMOS 4 : new materials, processes and equipmentLeave the NDL website. Thin Film Transistors 9Leave the NDL website. Atomic layer deposition : at the 208th ECS Meeting, October 16-21, 2005, Los Angeles, California, USALeave the NDL website. Chemical Sensors 8 : chemical (gas, ion ,bio) sensors and analytical systemsLeave the NDL website. Magnetic materials, processes, and devices 9Leave the NDL website. High purity siliconLeave the NDL website. Cleaning Technology in Semiconductor Device Manufacturing IXLeave the NDL website. Analytical and diagnostic techniques for semiconductor materials, devices and processes 7Leave the NDL website. Silicon-on-insulator technology and devices 13Leave the NDL website. Electrochemical capacitor and hybrid power batteries 2008Leave the NDL website. Nanostructured Metal Oxides : Processing and ApplicationsLeave the NDL website. Silicon nitride, silicon dioxide, and emerging dielectrics 9Leave the NDL website. State-of-the-Art Program on Compound Semiconductors 48 (SOTAPOCS 48) and ZnO, InZnO, and InGaO Related Materials and Devices for Electronic and Photonic ApplicationsLeave the NDL website. Solid State Ionic Devices IVLeave the NDL website. Molten salts and ionic liquids 18Leave the NDL website.

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Paper

Material Type
図書
Publication, Distribution, etc.
Size
23 cm
Alternative Title
Electrochemical Society transactions
Text Language Code
en
Target Audience
一般
Note (General)
Formerly: Electrochemical Society proceedings series
Related Material
ULSI process integration 5
State-of-the-art program on compound semiconductors 47 (SOTAPOCS 47) and wide-bandgap semiconductor materials and devices 8
Molten salts 15 : in memory of Robert Osteryoung
Solid oxide fuel cells 10 (SOFC-X)
Copper interconnects, new contact and barrier metallurgies/structures, and low-k interlevel dielectrics III : at the 208th ECS meeting, October 16-21, 2005, Los Angeles, California, USA
Durability and reliability of low-temperature fuel cells systems
Porous semiconductors : a symposium held in memory of Vitali Parkhutik and Volker Lehmann
Thin Film Transistor Technology 8
State-of-the-art program on compound semiconductors 46 (SOTAPOCS 46) and processes at the semiconductor/solution interface 2
Semiconductor Wafer Bonding : Science, Technology, and Applications
ZnO based thin films, nano-wires, and nano-belts for photonic and electronic devices and sensors
SiGe and Ge, materials, processing, and devices
Advanced gate stack, source/drain and channel engineering for Si-based CMOS 3 : new materials, processes and equipment
Electrochemistry in mineral and metal processing VII
Physics and Chemistry of SiO2 and the Si-SiO2 Interface-5
Atomic layer deposition applications
Dielectrics for nanosystems II: materials science, processing, reliability, and manufacturing
30th fuel cell seminar
Physics and technology of high-k gate dielectrics
Physics and technology of high-k materials 9
Advanced gate stack, source/drain and channel engineering for Si-based CMOS 2: new materials, processes, and equipment
Microelectronics Technology and Devices : SBMICRO 2007
Chemical Sensors 7 and MEMS/NEMS 7
Silicon materials science and technology X
Critical factors in localized corrosion 5 : a symposium in honor of Hugh Isaacs
SiGe, Ge, and related compounds : materials, processing, and devices
Advanced gate stack, source/drain, and channel engineering for si-based CMOS 6 : new materials, processes, and equipment
Dielectrics for nanosystems 4 : materials science, processing, reliability, and manufacturing
Microelectronics Technology and Devices : SBMICRO 2006
Corrosion protective coatings and inhibitors : at the 208th ECS Meeting, October 16-21, 2005, Los Angeles, California, USA
Proton exchange membrane fuel cells
State-of-the-art program on compound semiconductors 45 (SOTAPOCS 45) and wide bandgap semiconductor materials and devices 7
State-of-the-Art Program on Compound Semiconductors (SOTAPOCS XLIII) and Nitride and Wide Bandgap Semiconductors for Sensors, Photonics, and Electronics VI
Cleaning and surface conditioning technology in semiconductor device manufacturing 10
ULSI process integration 7
State-of-the-Art Program on Compound Semiconductors 49 (SOTAPOCS 49) and Nitrides and Wide-Bandgap Semiconductors for Sensors, Photonics, and Electronics 9
Corrosion and electrochemistry of advanced materials, in Honor of Koji Hashimoto
Dielectrics for nanosystems 3: materials science, processing, reliability, and manufacturing
Fuel cell ceminar 2007
High Purity Silicon 11
Advanced gate stack, source/drain and channel engineering for Si-based CMOS 4 : new materials, processes and equipment
Thin Film Transistors 9
Atomic layer deposition : at the 208th ECS Meeting, October 16-21, 2005, Los Angeles, California, USA
Chemical Sensors 8 : chemical (gas, ion ,bio) sensors and analytical systems
Magnetic materials, processes, and devices 9
High purity silicon
Cleaning Technology in Semiconductor Device Manufacturing IX
Analytical and diagnostic techniques for semiconductor materials, devices and processes 7
Silicon-on-insulator technology and devices 13
Electrochemical capacitor and hybrid power batteries 2008
Nanostructured Metal Oxides : Processing and Applications
Silicon nitride, silicon dioxide, and emerging dielectrics 9
State-of-the-Art Program on Compound Semiconductors 48 (SOTAPOCS 48) and ZnO, InZnO, and InGaO Related Materials and Devices for Electronic and Photonic Applications
Solid State Ionic Devices IV
Molten salts and ionic liquids 18