図書

24th Symposium on "Microjoining and Assembly Technology in Electronics", January 30-31, 2018, Yokohama

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24th Symposium on "Microjoining and Assembly Technology in Electronics", January 30-31, 2018, Yokohama

Material type
図書
Author
Symposium on Microjoining and Assembly Technology in Electronicsほか
Publisher
溶接学会
Publication date
2018.1
Material Format
Paper
Capacity, size, etc.
30cm
NDC
-
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Notes on use

Note (General):

Sponsored by Committee on Manufacturing Science and Technology in Electronics (SPS), Microjoining Commission (JWS)参考文献あり抄録は英語

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Paper

Material Type
図書
Publication, Distribution, etc.
Publication Date
2018.1
Publication Date (W3CDTF)
2018
Size
30cm
Alternative Title
Mate 2018
第24回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集, Vol.24, 2018
Proceedings of the 24th Symposium on Microjoining and Assembly Technology in Electronics, Vol.24, 2018
Place of Publication (Country Code)
ja
Target Audience
一般