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World scientific series on emerging technologies

World scientific series on emerging technologies
Paper図書
series editor, Avram Bar-CohenWorld Scientificc2020
Other Libraries in Japan
  • Author HeadingBar-Cohen, Avram

Encyclopedia of thermal packaging : a guide to cooling of electeronic equipment. Set 3 Thermal packaging applications

Encyclopedia of thermal packaging : a guide to cooling of electeronic equipment. Set 3 Thermal packaging applications
Paper図書
editor-in-chief, Avram Bar-Cohen.World Scientific Publishing Co. Pte. Ltd.[2019]<ND351-B96>
National Diet Library
  • Author HeadingBar-Cohen, Avram, 1946-

Thermally-informed design of microelectronic components

Thermally-informed design of microelectronic components
Paper図書
Ankur Srivastava ... [et al.] ; editor-in-chief, Avram Bar-CohenWorld Scientificc2015
Other Libraries in Japan
  • Author HeadingSrivastava, Ankur Bar-Cohen, Avram

Energy optimization and thermal management of data centers

Energy optimization and thermal management of data centers
Paper図書
Bahgat Sammakia ... [et al.] ; editor-in-chief, Avram Bar-CohenWorld Scientificc2015
Other Libraries in Japan
  • Author HeadingSammakia, Bahgat Bar-Cohen, Avram

Encyclopedia of thermal packaging : a guide to cooling of electronic equipment. Set 2 Thermal packaging tools

Encyclopedia of thermal packaging : a guide to cooling of electronic equipment. Set 2 Thermal packaging tools
Paper図書
editor-in-chief, Avram Bar-Cohen.World Scientific[2015]<ND351-B64>
National Diet Library
  • Author HeadingBar-Cohen, Avram, 1946-

Compact thermal models of electronic components

Compact thermal models of electronic components
Paper図書
Clemens Lasance, Mohammed-Nabil Sabry ; editor-in-chief, Avram Bar-CohenWorld Scientificc2015
Other Libraries in Japan
  • Author HeadingLasance, Clemens Sabry, Mohammed-Nabil Bar-Cohen, Avram

Encyclopedia of packaging materials, processes, and mechanics. Set 1 Interconnect and wafer bonding technology

Encyclopedia of packaging materials, processes, and mechanics. Set 1 Interconnect and wafer bonding technology
Paper図書
editor-in-chief Avram Bar-Cohen, Jeffrey C Suhling and Andrew A.O. Tay.World Scientific Publishing Co. Pte. Ltd.[2020]<NB141-D1>
National Diet Library
  • Author HeadingBar-Cohen, Avram, 1946- Suhling, J. C. (Jeffre...

Cooling of microelectronic and nanoelectronic equipment : advances and emerging research

Cooling of microelectronic and nanoelectronic equipment : advances and emerging research
Paper図書
editors, Madhusudan Iyengar, Karl J.L. Geisler, Bahgat Sammakia ; editor-in-chief, Avram Bar-CohenWorld Scientificc2015
Other Libraries in Japan
  • Author HeadingIyengar, Madhusudan Geisler, Karl J. L. Sammakia, Bahgat Bar-Cohen, Avram

Dielectric liquid cooling of immersed components

Dielectric liquid cooling of immersed components
Paper図書
Karl J.L. Geisler, Avram Bar-CohenWorld Scientificc2013
Other Libraries in Japan
  • Author HeadingGeisler, Karl J. L. Bar-Cohen, Avram

Encyclopedia of thermal packaging. Set 1 Thermal packaging techniques

Encyclopedia of thermal packaging. Set 1 Thermal packaging techniques
Paper図書
editor-in-chief, Avram Bar-Cohen.World Scientific[2013]<ND351-B63>
National Diet Library
  • Author HeadingBar-Cohen, Avram, 1946-

Convective flow and pool boiling : proceedings of the International Engineering Foundation 3rd conference held at Isree, Germany, May 18th-23rd : case

Convective flow and pool boiling : proceedings of the International Engineering Foundation 3rd conference held at Isree, Germany, May 18th-23rd : case
Paper図書
Engineering Foundation ; editors, Franz Mayinger, Markus Lehner ; associate editors, Avram Bar-Cohen ... [et al.]Taylor & Francisc1999
Other Libraries in Japan
  • Author HeadingMayinger, F. Lehner, Markus Engineering Foundation (U.S.) Bar-Cohen, Avram

Design and analysis of heat sinks

Design and analysis of heat sinks
Paper図書
Allan D. Kraus, Avram Bar-CohenJohn Wiley & Sonsc1995
Other Libraries in Japan
  • Author HeadingKraus, Allan D. Bar-Cohen, Avram

Advances in thermal modeling of electronic components and systems v. 2 v. 3

Advances in thermal modeling of electronic components and systems v. 2 v. 3
Paper図書
editors: Avram Bar-Cohen, Allan D. KrausASME Press1990-
Other Libraries in Japan
  • Author HeadingBar-Cohen, Avram Kraus, Allan D.

Advances in electronic packaging 1995 : proceedings of the International Intersociety Electronic Packaging Conference - INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii v. 1 v. 2

Advances in electronic packaging 1995 : proceedings of the International Intersociety Electronic Packaging Conference - INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii v. 1 v. 2
Paper図書
sponsored by the Electrical and Electronic Packaging Division, ASME, the Japan Society of Mechanical Engineers ; edited by Tai Ran Hsu, Avram Bar-Cohen, Wataru NakayamaAmerican Society of Mechanical Engineersc1995
Other Libraries in Japan
  • Author Heading...e Hsu, Tai-Ran Bar-Cohen, Avram 中山, 恒 American Society of Mec...

Advances in thermal modeling of electronic components and systems v. 1

Advances in thermal modeling of electronic components and systems v. 1
Paper図書
Avram Bar-Cohen, Allan D. KrausHemisphere Pub.c1988
Other Libraries in Japan
  • Author HeadingBar-Cohen, Avram Kraus, Allan D.

Thermal analysis and control of electronic equipment McGraw-Hill

Thermal analysis and control of electronic equipment McGraw-Hill
Paper図書
Allan D. Kraus, Avram Bar-CohenHemisphere Pub. Corp.c1983
Other Libraries in Japan
  • Author HeadingKraus, Allan D. Bar-Cohen, Avram

Heat transfer in electronic equipment, 1986 : presented at the AIAA/ASME 4th Thermophysics and Heat Transfer Conference, Boston, Massachusetts, June 2-4, 1986

Heat transfer in electronic equipment, 1986 : presented at the AIAA/ASME 4th Thermophysics and Heat Transfer Conference, Boston, Massachusetts, June 2-4, 1986
Paper図書
sponsored by the K-16 Committee on Heat Transfer in Electronic Equipment, the Heat Transfer Division, ASME ; edited by A. Bar-CohenAmerican Society of Mechanical Engineersc1986
Other Libraries in Japan
  • Author Heading...fer Conference Bar-Cohen, Avram American Society of Mechanica...

Heat transfer in electronic equipment, 1983 : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Boston, Massachusetts, November 13-18, 1983

Heat transfer in electronic equipment, 1983 : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Boston, Massachusetts, November 13-18, 1983
Paper図書
sponsored by the K-12 Committee on Aircraft and Astronautical Heat Transfer, the Heat Transfer Division, ASME ; edited by S. Oktay, A. Bar-CohenAmerican Society of Mechanical Engineersc1983
Other Libraries in Japan
  • Author Heading...sfer Oktay, S. Bar-Cohen, Avram

Heat transfer in electronic equipment 1983 : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Boston, Massachusetts, November 13-18, 1983 / sponsored by the K-12 Committee on Aircraft and Astronautical Heat Transfer, the Heat Transfer Division, ASME ; edited by S. Oktay, A. Bar-Cohen. (HTD ; v. 28)

Heat transfer in electronic equipment 1983 : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Boston, Massachusetts, November 13-18, 1983 / sponsored by the K-12 Committee on Aircraft and Astronautical Heat Transfer, the Heat Transfer Division, ASME ; edited by S. Oktay, A. Bar-Cohen. (HTD ; v. 28)
Paper図書
American Society of Mechanical Engineersc1983.<M15-A2811>
National Diet Library
  • Author Heading...ss.) Oktay, S. Bar-Cohen, Avram, 1946- American Society of Me...

WSPC Series in Advanced Integration and Packaging

WSPC Series in Advanced Integration and Packaging
Paper図書
Series editors, Avram Bar-Cohen, Shi-Wei Ricky LeeWorld Scientific
Other Libraries in Japan
  • Author HeadingBar-Cohen, Avram Lee, Shi-Wei Ricky

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