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Semiconductor advanced packaging

Semiconductor advanced packaging
Paper図書
John H. LauSpringer[2021]<ND371-D23>
National Diet LibraryOther Libraries in Japan
  • Author HeadingLau, John H.

Flip chip, hybrid bonding, fan-in, and fan-out technology

Flip chip, hybrid bonding, fan-in, and fan-out technology
Paper図書
John H. LauSpringerc2024
Other Libraries in Japan
  • Author HeadingLau, John H.

Chiplet design and heterogeneous integration packaging

Chiplet design and heterogeneous integration packaging
Paper図書
John H. LauSpringer Nature Singaporec2023
Other Libraries in Japan
  • Author HeadingLau, John H.

Heterogeneous integrations

Heterogeneous integrations
Paper図書
John H. LauSpringerc2019
Other Libraries in Japan
  • Author HeadingLau, John H.

3D IC integration and packaging

3D IC integration and packaging
Paper図書
John H. LauMcGraw-Hill Educationc2016
Other Libraries in Japan
  • Author HeadingLau, John H.

Effects of printed circuit board thickness on solder joint reliability of flip chip assemblies with imperfect underfill ASME-99-IMECE/EEP-4

Effects of printed circuit board thickness on solder joint reliability of flip chip assemblies with imperfect underfill ASME-99-IMECE/EEP-4
Paper規格・テクニカルリポート類
Lau, John H, Lee, S.-W. Ricky1999<M-ASME-99-IMECE/EEP-4>
National Diet Library

Solder joint reliability of wafer level chip scale packages (WLCSP): a time-temperature-dependent creep analysis ASME-99-IMECE/EEP-5

Solder joint reliability of wafer level chip scale packages (WLCSP): a time-temperature-dependent creep analysis ASME-99-IMECE/EEP-5
Paper規格・テクニカルリポート類
Lau, John H, Lee, S.-W. Ricky, Chang, Chris, Chen, Chih-Chiang1999<M-ASME-99-IMECE/EEP-5>
National Diet Library

Time-history popcorning analysis of plastic ball grid array package during solder reflow with fracture mechanics method ASME-98-WA/EEP-6

Time-history popcorning analysis of plastic ball grid array package during solder reflow with fracture mechanics method ASME-98-WA/EEP-6
Paper規格・テクニカルリポート類
Lau, John H, Ouyang, Chien, Chen, Ray1998<M-ASME-98-WA/EEP-6>
National Diet Library

Solder joint realiability of plastic ball grid array with solder bumped flip chip ASME-97-WA/EEP-6

Solder joint realiability of plastic ball grid array with solder bumped flip chip ASME-97-WA/EEP-6
Paper規格・テクニカルリポート類
Lee, S-W. Ricky, Lau, John H1997<M-ASME-97-WA/EEP-6>
National Diet Library

Temperature-dependent elasto-plastic-creep analysis of a chip scale package(CSP)'s solder joints ASME-96-WA/EEP-10

Temperature-dependent elasto-plastic-creep analysis of a chip scale package(CSP)'s solder joints ASME-96-WA/EEP-10
Paper規格・テクニカルリポート類
Lau, John H, Jung, Wen-Je, Pao, Yi-Hsin1996<M-ASME-96-WA/EEP-10>
National Diet Library

Thermal resistance and thermal warpage of cavity-down plastic ball grid array packages ASME-96-WA/EEP-1

Thermal resistance and thermal warpage of cavity-down plastic ball grid array packages ASME-96-WA/EEP-1
Paper規格・テクニカルリポート類
Chen, Kuan-Luen, Lau, John H, Wu, Frank H1996<M-ASME-96-WA/EEP-1>
National Diet Library

Microvias : for low cost, high density interconnects

Microvias : for low cost, high density interconnects
Paper図書
John H. Lau , S.W. Ricky LeeMcGraw-Hillc2001
Other Libraries in Japan
  • Author HeadingLau, John H. Lee, S. W Ricky

Chip scale package (CSP) : design, materials, processes, reliability, and applications

Chip scale package (CSP) : design, materials, processes, reliability, and applications
Paper図書
John H. Lau, Shi-Wei Ricky LeeMcGraw-Hillc1999
Other Libraries in Japan
  • Author HeadingLau, John H. Lee, Shi-Wei Ricky

Ｆｌｉｐ　ｃｈｉｐ　ｔｅｃｈｎｏｌｏｇｉｅｓ (Ｅｌｅｃｔｒｏｎｉｃ　ｐａｃｋａｇｉｎｇ　ａｎｄ　ｉｎｔｅｒｃｏｎｅｃｔｉｏｎ　ｓｅｒｉｅｓ)

Ｆｌｉｐ　ｃｈｉｐ　ｔｅｃｈｎｏｌｏｇｉｅｓ (Ｅｌｅｃｔｒｏｎｉｃ　ｐａｃｋａｇｉｎｇ　ａｎｄ　ｉｎｔｅｒｃｏｎｅｃｔｉｏｎ　ｓｅｒｉｅｓ)
Paper図書
ＪｏｈｎＨ．Ｌａｕ，ｅｄｉｔｏｒ．ＭｃＧｒａｗ－Ｈｉｌｌｃ１９９６．
Other Libraries in Japan

Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies : hc

Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies : hc
Paper図書
John H. Lau, Yi-Hsin PaoMcGraw-Hillc1997
Other Libraries in Japan
  • Author HeadingLau, John H. Pao, Yi-Hsin

Ball grid array technology : acid-free paper

Ball grid array technology : acid-free paper
Paper図書
John H. Lau, editorMcGraw-Hillc1995
Other Libraries in Japan
  • Author HeadingLau, John H.

Handbook of fine pitch surface mount technology

Handbook of fine pitch surface mount technology
Paper図書
edited by John H. LauVan Nostrand Reinholdc1994
Other Libraries in Japan
  • Author HeadingLau, John H.

Chip on board technologies for multichip modules

Chip on board technologies for multichip modules
Paper図書
edited by John H. LauVan Nostrand Reinholdc1994
Other Libraries in Japan
  • Author HeadingLau, John H.

Thermal stress and strain in microelectronics packaging

Thermal stress and strain in microelectronics packaging
Paper図書
edited by John H. LauVan Nostrand Reinholdc1993
Other Libraries in Japan
  • Author HeadingLau, John H.

Handbook of tape automated bonding

Handbook of tape automated bonding
Paper図書
edited by John H. LauVan Nostrand Reinholdc1992
Other Libraries in Japan
  • Author HeadingLau, John H.
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