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Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Paper
図書
Er-Ping Li.
Wiley
c2012.
<ND386-B26>
National Diet Library
Author Heading
Li, Er-Ping.
Proceedings of 2008 Asia-Pacific symposium on electromagnetic compatibility and 19th international Zurich symposium on electromagnetic compatibility : proceedings : 19-22 May 2008 : Singapore. : May 2008, Singapore.
Proceedings of 2008 Asia-Pacific symposium on electromagnetic compatibility and 19th international Zurich symposium on electromagnetic compatibility : proceedings : 19-22 May 2008 : Singapore. : May 2008, Singapore.
Paper
図書
Research Publishing Services
c2008.
<M17-09-353>
National Diet Library
Author Heading
...ng (Singapore)
Li, Er-Ping.
Asia-Pacific Symposium on Ele...
Plasmonic nanoelectronics and sensing
Plasmonic nanoelectronics and sensing
Paper
図書
Er-Ping Li and Hong-Son Chu
Cambridge University Press
2014
Other Libraries in Japan
Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC : hardback
Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC : hardback
Paper
図書
Er-Ping Li
IEEE Press
c2012
Other Libraries in Japan
Proceedings of 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, 19-22 May 2008, Singapore : proceedings
Proceedings of 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, 19-22 May 2008, Singapore : proceedings
Paper
図書
editor, Er-Ping Li
Research Publishing Services
c2008
Other Libraries in Japan
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