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Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A. : symposium F, "materials, technology and reliability of low-k dielectrics and copper interconnects" : 2006 MRS spring meeting : Apr 2006, San Francisco, CA. (Materials Research Society Symposia Proceedings ; 914)

Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A. : symposium F, "materials, technology and reliability of low-k dielectrics and copper interconnects" : 2006 MRS spring meeting : Apr 2006, San Francisco, CA. (Materials Research Society Symposia Proceedings ; 914)
Paper図書
Materials Research Societyc2006.<M17-06-2842>
National Diet Library
  • Author HeadingTsui, Ting Y. Materials Research Society. M...

Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A.

Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A.
Paper図書
editors, Ting Y. Tsui ... [et al.]Materials Research Societyc2006
Other Libraries in Japan
  • Author HeadingMaterials, Technology and Reliability of Low-k Dielectrics and Cooper Interconnects Tsui, Ting Y.

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