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Search results 46

2013 IEEE international symposium on advanced packaging materials : (APM 2013) : Irvine, California, USA : 27 February-1 March 2013 : Feb 2013, Irvine, CA.

2013 IEEE international symposium on advanced packaging materials : (APM 2013) : Irvine, California, USA : 27 February-1 March 2013 : Feb 2013, Irvine, CA.
Paper図書
IEEEc2013.<M17-14-308>
National Diet Library

2011 international symposium on advanced packaging materials : (APM 2011) : Xiamen, China : 25-28 October 2011 : Oct 2011, Xiamen, China.

2011 international symposium on advanced packaging materials : (APM 2011) : Xiamen, China : 25-28 October 2011 : Oct 2011, Xiamen, China.
Paper図書
IEEEc2011.<M17-12-2829>
National Diet Library

Advanced materials for thermal management of electronic packaging (Springer series in advanced microelectronics ; 30)

Advanced materials for thermal management of electronic packaging (Springer series in advanced microelectronics ; 30)
Paper図書
Xingcun Colin Tong.Springerc2011.<ND416-B46>
National Diet Library

IEEE CPMT international symposium and exhibition on advanced packaging materials processes, properties and interfaces : March 15-17, 2006 : Georgia Tech Hotel and Conference Center : (...) : Atlanta, GA 30308. : IEEE-CPMT 2006 conference : Mar 2006, Atlanta, GA.

IEEE CPMT international symposium and exhibition on advanced packaging materials processes, properties and interfaces : March 15-17, 2006 : Georgia Tech Hotel and Conference Center : (...) : Atlanta, GA 30308. : IEEE-CPMT 2006 conference : Mar 2006, Atlanta, GA.
Paper図書
IEEEc2006.<M17-07-898>
National Diet Library
  • Subject HeadingElectronic packaging -- Materials -- Congresses.

Advanced electronic packaging : symposium held November 27-30, 2006, Boston, Massachusetts, U.S.A. : symposium V, "advanced electronic packaging" : 2006 MRS fall meeting : Nov 2006, Boston, MA. (Materials Research Society Symposia Proceedings ; 968)

Advanced electronic packaging : symposium held November 27-30, 2006, Boston, Massachusetts, U.S.A. : symposium V, "advanced electronic packaging" : 2006 MRS fall meeting : Nov 2006, Boston, MA. (Materials Research Society Symposia Proceedings ; 968)
Paper図書
Materials Research Societyc2007.<M17-07-1566>
National Diet Library
  • Subject HeadingElectronic packaging -- Congresses. Electronic packaging -- Materials -- Congresses.

9th international symposium on advanced packaging materials: processes, properties and interfaces : 2004 proceedings : March 24-26, 2004 : Atlanta, Georgia U.S.A. : Mar 2004, Atlanta, GA.

9th international symposium on advanced packaging materials: processes, properties and interfaces : 2004 proceedings : March 24-26, 2004 : Atlanta, Georgia U.S.A. : Mar 2004, Atlanta, GA.
Paper図書
IEEEc2004.<M17-05-290>
National Diet Library
  • Subject HeadingElectronic packaging -- Materials -- Congresses.

Materials, integration and packaging issues for high-frequency devices : symposium held December 1-3, 2003, Boston, Massachusetts, U.S.A. : symposium B, the 1st MRS symposium on "materials, integration and packaging issues for high-frequency devices" : 2003 MRS fall meeting : Dec 2003, Boston, MA. (Materials Research Society Symposia Proceedings ; 783)

Materials, integration and packaging issues for high-frequency devices : symposium held December 1-3, 2003, Boston, Massachusetts, U.S.A. : symposium B, the 1st MRS symposium on "materials, integration and packaging issues for high-frequency devices" : 2003 MRS fall meeting : Dec 2003, Boston, MA. (Materials Research Society Symposia Proceedings ; 783)
Paper図書
Materials Research Societyc2004.<M17-04-2661>
National Diet Library
  • Subject HeadingElectronic packaging -- Materials -- Congresses.

8th international advanced packaging materials symposium : 2002 proceedings : March 3-6, 2002 : Stone Mountain, GA USA. : Mar 2002, Stone Mountain, GA.

8th international advanced packaging materials symposium : 2002 proceedings : March 3-6, 2002 : Stone Mountain, GA USA. : Mar 2002, Stone Mountain, GA.
Paper図書
IEEEc2002.<M17-03-4482>
National Diet Library
  • Subject HeadingElectronic packaging -- Materials -- Congresses.

Advanced materials for thermal management of electronic packaging : [pbk]

Advanced materials for thermal management of electronic packaging : [pbk]
Paper図書
Xingcun Colin TongSpringerc2011
Other Libraries in Japan
  • Subject HeadingElectronic apparatus and appliances -- Temperature control Electronic packaging -- Materials
  • Subject Heading (ID)Electronic apparatus and appliances -- Temperature control Electronic packaging -- Materials

Ceramic interconnect technology handbook

Ceramic interconnect technology handbook
Paper図書
edited by Fred D. Barlow III, Aicha ElshabiniCRC Press/Taylor & Francisc2007
Other Libraries in Japan
  • Subject HeadingElectronic ceramics Electronic packaging -- Materials Interconnects (Integrated cir...
  • Subject Heading (ID)Electronic ceramics Electronic packaging -- Materials Interconnects (Integrated cir...

Electronic packaging materials science : symposium held November 27-29, 1984, Boston, Massachusetts, U.S.A. / editors, Edward A. Giess, King-ning Tu, Donald R. Uhlmann. (Materials Research Society symposia proceedings ; v. 40)

Electronic packaging materials science : symposium held November 27-29, 1984, Boston, Massachusetts, U.S.A. / editors, Edward A. Giess, King-ning Tu, Donald R. Uhlmann. (Materials Research Society symposia proceedings ; v. 40)
Paper図書
Materials Research Society1985.<M15-A1038>
National Diet LibraryOther Libraries in Japan
  • Subject HeadingElectronic packaging -- Congresses. Electronic packaging -- Materials -- Congresses.

Advanced electronic packaging : symposium held November 27-30, 2006, Boston, Massachusetts, U.S.A.

Advanced electronic packaging : symposium held November 27-30, 2006, Boston, Massachusetts, U.S.A.
Paper図書
editors: Vasudeva P. Atluri ... [et al.]Materials Research Societyc2007
Other Libraries in Japan
  • Subject HeadingElectronic packaging -- Materials -- Congresses
  • Subject Heading (ID)Electronic packaging -- Materials -- Congresses

Plastics for electronics 2nd ed

Plastics for electronics 2nd ed
Paper図書
edited by Martin GooseyKluwer Academicc1999
Other Libraries in Japan
  • Subject HeadingPlastics Electronics -- Materials Electronic packaging -- Materials
  • Subject Heading (ID)Plastics Electronics -- Materials Electronic packaging -- Materials

2005 10th International Symposium on Advanced Packaging Materials : processes, properties and interfaces : March 16-18, 2005, Irvine, CA

2005 10th International Symposium on Advanced Packaging Materials : processes, properties and interfaces : March 16-18, 2005, Irvine, CA
Paper図書
IEEEc2005
Other Libraries in Japan
  • Subject HeadingElectronic packaging -- Materials -- Congresses
  • Subject Heading (ID)Electronic packaging -- Materials -- Congresses

2004 proceedings, 9th International Symposium on Advanced Packaging Materials : processes, properties and interfaces, March 24-26, 2004, Atlanta, Georgia, USA

2004 proceedings, 9th International Symposium on Advanced Packaging Materials : processes, properties and interfaces, March 24-26, 2004, Atlanta, Georgia, USA
Paper図書
sponsors, IEEE Components, Packaging and Manufacturing Technology(CPMT) Society, Packaging Research Center at Georgia Tech(GT-PRC) ; technical sponsor, Fraunhofer IZM ; general chair, Petri Savolainen ; general chair elect, Jianmin Qu ; technical chair, Petri Savolainen ; technical chair elect, Suresh SitaramanIEEE Service Centerc2004
Other Libraries in Japan
  • Subject HeadingElectronic packaging -- Materials Congresses
  • Subject Heading (ID)Electronic packaging -- Materials Congresses

2002 proceedings, 8th International Advanced Packaging Materials Symposium, March 3-6, 2002, Stone Mountain, GA, USA

2002 proceedings, 8th International Advanced Packaging Materials Symposium, March 3-6, 2002, Stone Mountain, GA, USA
Paper図書
sponsors, IEEE Components, Packaging and Manufacturing Technology(CPMT) , Packaging Research Center at Georgia Tech(USA) ; technical sponsors, Fraunhofer IZM(Germany), Material Research Society ; general chair, Rajen Chanchan ; general chair elect, Andras Schubert ; technical chair, Jianmin Qu ; technical chair elect, Petri SavolainenIEEE Service Centerc2002
Other Libraries in Japan
  • Subject HeadingElectronic packaging -- Materials Congresses
  • Subject Heading (ID)Electronic packaging -- Materials Congresses

Plastics for electronics : materials, properties, and design applications

Plastics for electronics : materials, properties, and design applications
Paper図書
William M. AlvinoMcGraw-Hillc1995
Other Libraries in Japan
  • Subject HeadingElectronics -- Materials Plastics Electronic packaging -- Materials
  • Subject Heading (ID)Electronics -- Materials Plastics Electronic packaging -- Materials

Proceedings : International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 11-14, 2001 : soft.

Proceedings : International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 11-14, 2001 : soft.
Paper図書
co-sponsored by : International Microelectronics and Packaging Society (IMAPS), IEEE Components, Packing, and Manufacturing Technology (CPMT), Georgia Institute of Technology, Packaging Research Center (PRC) ; general chair, James E. Morris ; technical chairs, Andreas SchubertIMAPS[2001]
Other Libraries in Japan
  • Subject HeadingElectronic packaging -- Materials Congresses
  • Subject Heading (ID)Electronic packaging -- Materials Congresses

Proceedings : International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 6-8, 2000 :softbound

Proceedings : International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 6-8, 2000 :softbound
Paper図書
co-sponsored by International Microelectronics and Packaging Society (IMAPS) ... [et al.] ; general chair, C.P. Wong ... [et al.] ; technical chairs, Philip Garrou, James E. MorrisIMAPS[2000]
Other Libraries in Japan
  • Subject HeadingElectronic packaging -- Materials Congresses
  • Subject Heading (ID)Electronic packaging -- Materials Congresses

Soldering processes and equipment

Soldering processes and equipment
Paper図書
edited by Michael G. PechtWileyc1993
Other Libraries in Japan
  • Subject HeadingElectronic packaging -- Materials Solders and soldering Surface...
  • Subject Heading (ID)Electronic packaging -- Materials Solders and soldering Surface...