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2024 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)

2024 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
Digital電子書籍・電子雑誌図書
2024
National Diet Library

3D microelectronic packaging : from architectures to applications Second edition (Springer series in advanced microelectronics ; volume 64)

3D microelectronic packaging : from architectures to applications Second edition (Springer series in advanced microelectronics ; volume 64)
Paper図書
Yan Li, Deepak Goyal, editorsSpringer[2021]<ND354-D2>
National Diet LibraryOther Libraries in Japan
  • Summary, etc....ications of 3D microelectronic packaging. It provides readers an in-de...
  • Contents1. Introduction to 3D microelectronic packaging 2. 3D packaging architecture ...
  • Alternative TitleThree Dimensional microelectronic packaging

2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)

2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
Digital電子書籍・電子雑誌図書
2023
National Diet Library

2022 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)

2022 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
Digital電子書籍・電子雑誌図書
2022
National Diet Library

2019 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)

2019 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
Digital電子書籍・電子雑誌図書
2019
National Diet Library

3D microelectronic packaging : from fundamentals to applications (Springer series in advanced microelectronics ; volume 57)

3D microelectronic packaging : from fundamentals to applications (Springer series in advanced microelectronics ; volume 57)
Paper図書
Yan Li, Deepak Goyal, editors.Springer2017.<ND354-B6>
National Diet Library
  • Summary, etc....ications of 3D microelectronic packaging, an industry trend for future...
  • ContentsIntroduction to 3D Microelectronic Packaging 3D packaging architecture and...

2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)

2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
Digital電子書籍・電子雑誌図書
2018
National Diet Library

2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)

2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
Digital電子書籍・電子雑誌図書
2017
National Diet Library

Microelectronics Packaging Conference (EMPC), 2015 European

Microelectronics Packaging Conference (EMPC), 2015 European
Digital電子書籍・電子雑誌図書
2015
National Diet Library

Microelectronics Packaging Conference (EMPC) , 2013 European

Microelectronics Packaging Conference (EMPC) , 2013 European
Digital電子書籍・電子雑誌図書
2013
National Diet Library

IMAPS Nordic annual conference 2017 : Goteborg, Sweden : 18-20 June 2017 : IMAPS Nordic 2017 conference on microelectronics packaging : IMAPS/IEEE NordPac 2017 conference : Jun 2017, Goteborg, Sweden.

IMAPS Nordic annual conference 2017 : Goteborg, Sweden : 18-20 June 2017 : IMAPS Nordic 2017 conference on microelectronics packaging : IMAPS/IEEE NordPac 2017 conference : Jun 2017, Goteborg, Sweden.
Paper図書
IMAPS--Nordic[2017]<M17-19-635>
National Diet Library

18th European Microelectronics & Packaging Conference

18th European Microelectronics & Packaging Conference
Digital電子書籍・電子雑誌図書
2011
National Diet Library

2015 European microelectronics packaging conference : (EMPC 2015) : Friedrichshafen, Germany : 14-16 September 2015 : 20th European microelectronics and packaging conference & exhibition : Sep 2015, Friedrichshafen, Germany.

2015 European microelectronics packaging conference : (EMPC 2015) : Friedrichshafen, Germany : 14-16 September 2015 : 20th European microelectronics and packaging conference & exhibition : Sep 2015, Friedrichshafen, Germany.
Paper図書
IEEE[2015]<M17-17-1368>
National Diet Library

2013 European microelectronics packaging conference : (EMPC 2013) : Grenoble, France : 9-12 September 2013 : EMPC2013 : 19th European microelectronics and packaging conference : Sep 2013, Grenoble, France. CFP1354-ART

2013 European microelectronics packaging conference : (EMPC 2013) : Grenoble, France : 9-12 September 2013 : EMPC2013 : 19th European microelectronics and packaging conference : Sep 2013, Grenoble, France. CFP1354-ART
Paper図書
IEEE[2013]<M17-15-1049>
National Diet Library

Microelectronic packaging / edited by M. Datta, T. Osaka, J.W. Schultze. (New trends in electrochemical technology ; v. 3)

Microelectronic packaging / edited by M. Datta, T. Osaka, J.W. Schultze. (New trends in electrochemical technology ; v. 3)
Paper図書
CRC Pressc2005.<ND351-B15>
National Diet Library
  • Subject HeadingMicroelectronic packaging.

2011 18th European microelectronics & packaging conference : (EMPC 2011) : Brighton, United Kingdom : 12-15 September 2011 : Sep 2011, Brighton, UK.

2011 18th European microelectronics & packaging conference : (EMPC 2011) : Brighton, United Kingdom : 12-15 September 2011 : Sep 2011, Brighton, UK.
Paper図書
IEEEc2011.<M17-12-3482>
National Diet Library

Microelectronic packaging: ready for the next product generation SME-FC01-317

Microelectronic packaging: ready for the next product generation SME-FC01-317
Paper規格・テクニカルリポート類
Reichl, Herbert, Wolf, Jurgen2001<M-SME-FC01-317>
National Diet Library

Microelectronic packaging and laser processing : Conference : Jun 1997, Singapore. (SPIE Proceedings ; 3184)

Microelectronic packaging and laser processing : Conference : Jun 1997, Singapore. (SPIE Proceedings ; 3184)
Paper図書
SPIE1997.<M17-97-1820>
National Diet LibraryOther Libraries in Japan
  • Note (General)Selected papers. Index term: microelectronic packaging ; laser processing ; SPIE. BL...
  • Alternative Titlemicroelectronic packaging ; laser processing ; SPIE
  • Alternative Titlemicroelectronic packaging ; laser processing ; SPIE

Integration of simulation and testing for microelectronics package reliability improvement SAE-980345

Integration of simulation and testing for microelectronics package reliability improvement SAE-980345
Paper規格・テクニカルリポート類
Li, Quan, Dougherty, David, Xu, Yong Li1998<M-SAE-980345>
National Diet Library

Assessment of microelectronics packaging for high temperature, high reliability applications SAND-97-0745 DE97 006307

Assessment of microelectronics packaging for high temperature, high reliability applications SAND-97-0745 DE97 006307
Microform規格・テクニカルリポート類
Uribe, F1997<LS-DE97/006307>
National Diet Library
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